Intel 955X 6.5.3Mechanical Interface Material, 6.5.4Thermal Interface Material

Reference Thermal Solution

R

Figure 6-6. Plastic Wave Soldering Heatsink Extrusion Profile

NOTE: All dimensions are in millimeters, with dimensions in braces expressed in inches.

6.5.3Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

6.5.4Thermal Interface Material

A TIM provides improved conductivity between the die and heatsink. The reference thermal solution uses Honeywell PCM 45F, 0.25 mm (0.010 in.) thick, 15 mm x 15 mm

(0.59 in. x 0.59 in.) square.

Note: Unflowed or “dry” Honeywell PCM 45F has a material thickness of 0.010 inch. The flowed or “wet” Honeywell PCM 45F has a material thickness of ~0.003 inches after it reaches its phase change temperature.

Intel® 955X Express Chipset Thermal/Mechanical Design Guide 23