Thermal Specifications

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3 Thermal Specifications

3.1Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the chipset MCH to consume maximum power dissipation for sustained time periods. Therefore, to arrive at a more realistic power level for thermal design purposes, Intel characterizes power consumption based on known platform benchmark applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.

For TDP specifications, see Table 3-1for the 955X Express chipset MCH. FC-BGA packages have limited heat transfer capability into the board and have minimal thermal capability without a thermal solution. Intel recommends that system designers plan for one or more heatsinks when using the 955X Express chipset.

3.2Die Case Temperature Specifications

To ensure proper operation and reliability of the MCH, the die temperatures must be at or between the maximum/minimum operating range as specified in Table 3-1 for the 82955X MCH. System and/or component level thermal solutions are required to maintain these temperature specifications. Refer to Chapter 5 for guidelines on accurately measuring package die temperatures.

Table 3-1. MCH Thermal Specifications

Parameter

Value

Notes

 

 

 

Tcase_max

105 °C

—

 

 

 

Tcase_min

5 °C

—

 

 

 

TDPdual channel

13.5 W

DDR2-667

 

 

 

NOTE: These specifications are based on silicon characterization; however, they may be updated as further data becomes available.

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Intel® 955X Express Chipset Thermal/Mechanical Design Guide

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