Introduction
R
1 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
•Outline the thermal and mechanical operating limits and specifications for the Intel® 82955X Express Chipset Memory Controller Hub (MCH).
•Describe a reference thermal solution that meets the specification of the 82955X MCH.
Properly designed thermal solutions provide adequate cooling to maintain the MCH die temperatures at or below thermal specifications. This is accomplished by providing a low local- ambient temperature, ensuring adequate local airflow, and minimizing the die to
The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the 82955X MCH component only. For thermal design information on other chipset components, refer to the respective component datasheet. For the ICH7, refer to the Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines.
Note: Unless otherwise specified, the term MCH refers to the Intel® 82955X Express chipset MCH.
Intel® 955X Express Chipset Thermal/Mechanical Design Guide | 7 |