Intel 955X Contents

1	Introduction .........................................................................................................................				7
	1.1	Definition of Terms .................................................................................................			8
	1.2	Reference Documents............................................................................................			8
2	Packaging Technology........................................................................................................				9
	2.1	Package Mechanical Requirements.....................................................................			10
3	Thermal Specifications......................................................................................................				11
	3.1	Thermal Design Power (TDP) ..............................................................................			11
	3.2	Die Case Temperature Specifications..................................................................			11
4	Thermal Simulation ...........................................................................................................				13
5	Thermal Metrology ............................................................................................................				15
	5.1	Die Case Temperature Measurements................................................................			15
		5.1.1	Zero Degree Angle Attach Methodology ..............................................		15
6	Reference Thermal Solution			.............................................................................................	17
	6.1	Operating Environment ........................................................................................			17
	6.2	Heatsink Performance..........................................................................................			17
	6.3	Mechanical Design Envelope...............................................................................			18
	6.4	Board-Level Components Keep-out Dimensions.................................................			20
	6.5	Reference Heatsink Thermal Solution Assembly.................................................			21
		6.5.1	Heatsink Orientation .............................................................................		22
		6.5.2	Extruded Heatsink Profiles ...................................................................		22
		6.5.3	Mechanical Interface Material...............................................................		23
		6.5.4	Thermal Interface Material....................................................................		23
			6.5.4.1	Effect of Pressure on TIM Performance..............................	24
		6.5.5	Heatsink Clip.........................................................................................		24
		6.5.6	Clip Retention Anchors .........................................................................		24
	6.6	Reliability Guidelines ............................................................................................			25
7	Appendix A: Thermal Solution Component Suppliers.......................................................				27
8	Appendix B: Mechanical Drawings ...................................................................................				29

Intel® 955X Express Chipset Thermal/Mechanical Design Guide