R

Contents

1

Introduction .........................................................................................................................

 

7

 

1.1

Definition of Terms .................................................................................................

8

 

1.2

Reference Documents............................................................................................

8

2

Packaging Technology........................................................................................................

9

 

2.1

Package Mechanical Requirements.....................................................................

10

3

Thermal Specifications......................................................................................................

11

 

3.1

Thermal Design Power (TDP) ..............................................................................

11

 

3.2

Die Case Temperature Specifications..................................................................

11

4

Thermal Simulation ...........................................................................................................

13

5

Thermal Metrology ............................................................................................................

15

 

5.1

Die Case Temperature Measurements................................................................

15

 

 

5.1.1

Zero Degree Angle Attach Methodology ..............................................

15

6

Reference Thermal Solution

.............................................................................................

17

 

6.1

Operating Environment ........................................................................................

17

 

6.2

Heatsink Performance..........................................................................................

17

 

6.3

Mechanical Design Envelope...............................................................................

18

 

6.4

Board-Level Components Keep-out Dimensions.................................................

20

 

6.5

Reference Heatsink Thermal Solution Assembly.................................................

21

 

 

6.5.1

Heatsink Orientation .............................................................................

22

 

 

6.5.2

Extruded Heatsink Profiles ...................................................................

22

 

 

6.5.3

Mechanical Interface Material...............................................................

23

 

 

6.5.4

Thermal Interface Material....................................................................

23

 

 

 

6.5.4.1

Effect of Pressure on TIM Performance..............................

24

 

 

6.5.5

Heatsink Clip.........................................................................................

24

 

 

6.5.6

Clip Retention Anchors .........................................................................

24

 

6.6

Reliability Guidelines ............................................................................................

25

7

Appendix A: Thermal Solution Component Suppliers.......................................................

27

8

Appendix B: Mechanical Drawings ...................................................................................

29

Intel® 955X Express Chipset Thermal/Mechanical Design Guide

3