Reference Thermal Solution

R

6.6Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6-2.

Table 6-2. Reliability Guidelines

Test1

Requirement

Pass/Fail Criteria2

 

 

 

Mechanical Shock

50 g, board level, 11 msec, 3 shocks/axis.

Visual Check and Electrical

 

 

Functional Test

 

 

 

Random Vibration

7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz.

Visual Check and Electrical

 

 

Functional Test

 

 

 

Temperature Life

85°C, 2000 hours total, checkpoints at 168, 500,

Visual Check

 

1000, and 2000 hours.

 

 

 

 

Thermal Cycling

–5 °C to +70 °C, 500 cycles.

Visual Check

 

 

 

Humidity

85% relative humidity, 55 °C, 1000 hours.

Visual Check

 

 

 

NOTES:

1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.

2.Additional pass/fail criteria may be added at the discretion of the user.

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Intel® 955X Express Chipset Thermal/Mechanical Design Guide

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