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Reference Thermal Solution
R
6.6Reliability Guidelines
Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table
Table
Test1 | Requirement | Pass/Fail Criteria2 |
|
|
|
Mechanical Shock | 50 g, board level, 11 msec, 3 shocks/axis. | Visual Check and Electrical |
|
| Functional Test |
|
|
|
Random Vibration | 7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz. | Visual Check and Electrical |
|
| Functional Test |
|
|
|
Temperature Life | 85°C, 2000 hours total, checkpoints at 168, 500, | Visual Check |
| 1000, and 2000 hours. |
|
|
|
|
Thermal Cycling | Visual Check | |
|
|
|
Humidity | 85% relative humidity, 55 °C, 1000 hours. | Visual Check |
|
|
|
NOTES:
1.It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.
2.Additional pass/fail criteria may be added at the discretion of the user.
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide | 25 |