Thermal Metrology

R

Figure 5-1. Thermal Solution Decision Flowchart

Start

Attach device to board using normal reflow process.

Attach thermocouples using recommended metrology. Setup the system in the desired configuration.

Run the Power program and monitor the device die temperature.

Tdie >

Specification? No

End

Heatsink

Select HeatsinkYes

Required

Therm_Solution_Flow

Figure 5-2. Zero Degree Angle Attach Methodology

Figure 5-3. Zero Degree Angle Attach Methodology (Top View)

Die

Thermocouple

Wire

Cement +

Thermocouple Bead

Substrate

0_Angle_Attach_Method

NOTE: Not to scale.

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16

Intel® 955X Express Chipset Thermal/Mechanical Design Guide