![](/images/backgrounds/110396/110396-3616x1.png)
Thermal Metrology
R
Figure
Start
Attach device to board using normal reflow process.
Attach thermocouples using recommended metrology. Setup the system in the desired configuration.
Run the Power program and monitor the device die temperature.
Tdie >
Specification? No
End
Heatsink
Select HeatsinkYes
Required
Therm_Solution_Flow
Figure
Figure
Die
Thermocouple
Wire
Cement +
Thermocouple Bead
Substrate
0_Angle_Attach_Method
NOTE: Not to scale.
§
16 | Intel® 955X Express Chipset Thermal/Mechanical Design Guide |