Appendix A: Thermal Solution Component Suppliers
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7Appendix A: Thermal Solution Component Suppliers
This list is provided by Intel solely as a convenience to customers. Intel has not tested, designed or validated these products and does not warrant user suitability or performance in any way. Customers are solely responsible for determining the suitability and application of these products for their designs.
Table
Part | Intel Part | Supplier | Contact Information | |
Number | (Part Number) | |||
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Heatsink Assembly |
|
| Monica Chih (Taiwan) | |
includes: |
|
| ||
⎯ |
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| ||
⎯ Thermal Interface | CCI | Harry Lin | ||
Material |
|
| ||
⎯ Ramp Clip |
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| ||
|
| hlinack@aol.com | ||
⎯ Wire Clip |
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| ||
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| ||
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|
| |
|
|
| Monica Chih (Taiwan) | |
|
|
| ||
CCI | ||||
| ||||
|
|
| Harry Lin | |
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| ||
|
|
| hlinack@aol.com | |
Thermal Interface |
| Honeywell | Scott Miller | |
(PCM 45F) | PCM 45F | |||
| scott.miller4@honeywell.com | |||
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| |
|
|
| Monica Chih (Taiwan) | |
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| ||
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Heatsink Ramp Clip | CCI |
| ||
|
|
| Harry Lin | |
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| ||
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|
| hlinack@aol.com | |
|
|
| Monica Chih (Taiwan) | |
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| ||
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| ||
Heatsink Wire Clip | CCI | Harry Lin | ||
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| ||
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| ||
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|
| hlinack@aol.com | |
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Intel® 955X Express Chipset Thermal/Mechanical Design Guide | 27 |