Introduction

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1.1Definition of Terms

Term

Description

 

 

BGA

Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is

 

mounted, bonded and encapsulated in molding compound. The primary electrical interface is

 

an array of solder balls attached to the substrate opposite the die and molding compound.

 

 

BLT

Bond line thickness. Final settled thickness of the thermal interface material after installation

 

of heatsink.

 

 

ICH7

I/O Controller Hub. Seventh generation I/O Controller Hub component that contains

 

additional functionality compared to previous ICH components. The I/O Controller Hub

 

component that contains the primary PCI interface, LPC interface, USB2, ATA-100, and

 

other I/O functions. It communicates with the MCH over a proprietary interconnect called

 

DMI.

 

 

MCH

Memory Controller Hub. The chipset component that contains the processor interface, the

 

memory interface, and the DMI.

 

 

Tcase_max

Maximum die temperature allowed. This temperature is measured at the geometric center of

 

the top of the package die.

 

 

Tcase_min

Minimum die temperature allowed. This temperature is measured at the geometric center of

 

the top of the package die.

 

 

TDP

Thermal design power. Thermal solutions should be designed to dissipate this target power

 

level. TDP is not the maximum power that the chipset can dissipate.

 

 

1.2Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

Document Title

Document Number / Location

 

 

Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines

http://developer.intel.com//desi

 

gn/chipsets/designex/307015.htm

 

 

Intel® I/O Controller Hub 7 (ICH7) Datasheet

http://developer.intel.com//design/c

 

hipsets/datashts/307013.htm

 

 

Intel® 955X Express Chipset Datasheet

http://developer.intel.com/design/c

 

hipsets/datashts/306828.htm

 

 

BGA/OLGA Assembly Development Guide

Contact your Intel Field Sales

 

Representative

 

 

Various system thermal design suggestions

http://www.formfactors.org

 

 

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Intel® 955X Express Chipset Thermal/Mechanical Design Guide