Intel 955X 2.1Package Mechanical Requirements

Packaging Technology

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Figure 2-3. MCH Package Dimensions (Bottom View)

NOTES:

1.All dimensions are in millimeters.

2.All dimensions and tolerances conform to ANSI Y14.5M-1994.

2.1Package Mechanical Requirements

The MCH package has an exposed bare die that is capable of sustaining a maximum static normal load of 10-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Note:

1.The heatsink attach solutions must not result in continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2.These specifications apply to uniform compressive loading in a direction perpendicular to the bare die top surface.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only.

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10 Intel® 955X Express Chipset Thermal/Mechanical Design Guide