Reference Thermal Solution

R

6.4Board-Level Components Keep-out Dimensions

The location of hole patterns and keep-out zones for the reference thermal solution are shown in Figure 6-3 and Figure 6-4.

Figure 6-3. MCH Heatsink Board Component Keep-out

60.6mm

48.0mm

26.79mm

 

 

 

 

 

 

 

 

 

 

TNB

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

45.79mm

 

 

 

 

81.0mm

 

 

 

 

 

 

 

 

 

67.0mm

 

 

 

 

 

HeatsinkFin

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

135O

47.0mm

60.92mm

Max 2.2mm

Component

Height

No component

this Area

Air Flow

HS_Brd_Component_Keepout

20

Intel® 955X Express Chipset Thermal/Mechanical Design Guide