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Reference Thermal Solution
R
6.4Board-Level Components Keep-out Dimensions
The location of hole patterns and
Figure
60.6mm
48.0mm
26.79mm
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| 45.79mm |
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81.0mm |
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| 67.0mm |
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135O
47.0mm
60.92mm
Max 2.2mm
Component
Height
No component
this Area
Air Flow
HS_Brd_Component_Keepout
20 | Intel® 955X Express Chipset Thermal/Mechanical Design Guide |