Reference Thermal Solution
R
Figure
4x 5.08mm
4x 1.84mm
4x 8.76mm
Max1.27mm
Component
Height
4x 8.76mm
NoComponents
this Area
8 x Ø0.97 mm Plated ThruHole
8 x Ø1.42 mm Trace Keepout
RM_Component_KeepoutZones
6.5Reference Heatsink Thermal Solution Assembly
The reference thermal solution for the MCH is a passive extruded heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.
Intel® 955X Express Chipset Thermal/Mechanical Design Guide | 21 |