Reference Thermal Solution

R

Figure 6-4. Retention Mechanism Component Keep-out Zones

4x 5.08mm

4x 1.84mm

4x 8.76mm

Max1.27mm

Component

Height

4x 8.76mm

NoComponents

this Area

8 x Ø0.97 mm Plated ThruHole

8 x Ø1.42 mm Trace Keepout

RM_Component_KeepoutZones

6.5Reference Heatsink Thermal Solution Assembly

The reference thermal solution for the MCH is a passive extruded heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 6-5 shows the reference thermal solution assembly and associated components.

Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B. Appendix A contains vendor information for each thermal solution component.

Intel® 955X Express Chipset Thermal/Mechanical Design Guide

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