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Intel
955X manual
14
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36
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36 pages, 553.67 Kb
Thermal Simulation
R
14
Intel
®
955X Express Chipset Thermal/Mechanical Design Guide
Contents
Intel® 955X Express Chipset
Page
Contents
Figures
Tables
Revision History
Page
1 Introduction
1.1Definition of Terms
1.2Reference Documents
2 Packaging Technology
2.1Package Mechanical Requirements
3 Thermal Specifications
3.1Thermal Design Power (TDP)
3.2Die Case Temperature Specifications
Page
4 Thermal Simulation
Page
5 Thermal Metrology
5.1Die Case Temperature Measurements
5.1.1Zero Degree Angle Attach Methodology
Page
6 Reference Thermal Solution
6.1Operating Environment
6.2Heatsink Performance
6.3Mechanical Design Envelope
Page
6.4Board-LevelComponents Keep-outDimensions
6.5Reference Heatsink Thermal Solution Assembly
6.5.1Heatsink Orientation
6.5.2Extruded Heatsink Profiles
6.5.3Mechanical Interface Material
6.5.4Thermal Interface Material
6.5.5Heatsink Clip
6.5.6Clip Retention Anchors
6.6Reliability Guidelines
Page
7Appendix A: Thermal Solution Component Suppliers
Page
8 Appendix B: Mechanical Drawings
