Intel 955X 2 Packaging Technology

Packaging Technology

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2 Packaging Technology

The 955X Express chipset consists of two individual components: the MCH and the ICH7. The MCH component uses a 34 mm squared, 6-layer flip chip ball grid array (FC-BGA) package (see Figure 2-1 through Figure 2-3). For information on the ICH7 package, refer to the Intel® I/O Controller Hub 7 (ICH7) Thermal Design Guidelines.

Figure 2-1. MCH Package Dimensions (Top View)

CapacitorArea,				Ø5.20mm
HandlingExclusion		19.38		Die
Zone				Keepout
		10.67		Area
3.1			2.30
		MCH	2.0
15.34	9.14			34.00
		Die
3.1			3.0
		6.17
HandlingArea		2.54
		34.00
				955X_Pkg_TopView
Figure 2-2. MCH Package Dimensions (Side View)
Substrate	0.84 ± 0.05 mm
2.355 ± 0.082 mm	Decoup	Die
1.92 ± 0.078 mm	Cap		0.7 mm Max	0.20 See note 4.
				0.20 –C–
0.435 ± 0.025 mm		Seating Plane
See note 3				See note 1.

Notes:

1.Primary datum -C- and seating plan are defined by the spherical crow ns of the solder balls (show n before motherboard attach)

2.All dimensions and tolerances conform to ANSI Y14.5M-1994

3.BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4.Show n before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bow l shaped)orientationafterreflow

955X_Pkg_SideView

Intel® 955X Express Chipset Thermal/Mechanical Design Guide 9