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Packaging Technology
R
2 Packaging Technology
The 955X Express chipset consists of two individual components: the MCH and the ICH7. The MCH component uses a 34 mm squared,
Figure
CapacitorArea, |
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| Ø5.20mm |
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HandlingExclusion |
| 19.38 |
| Die |
Zone |
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| Keepout | |
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| 10.67 |
| Area |
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3.1 |
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| 2.30 |
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| MCH | 2.0 |
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15.34 | 9.14 |
| 34.00 | |
Die |
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3.1 |
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| 3.0 |
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| 6.17 |
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HandlingArea | 2.54 |
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| 34.00 |
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| 955X_Pkg_TopView |
Figure |
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Substrate | 0.84 ± 0.05 mm |
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2.355 ± 0.082 mm | Decoup | Die |
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1.92 ± 0.078 mm | Cap | 0.7 mm Max | 0.20 See note 4. | |
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| 0.20 |
0.435 ± 0.025 mm |
| Seating Plane |
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See note 3 |
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| See note 1. |
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Notes:
1.Primary datum
2.All dimensions and tolerances conform to ANSI
3.BGA has a
4.Show n before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bow l shaped)orientationafterreflow
955X_Pkg_SideView
Intel® 955X Express Chipset Thermal/Mechanical Design Guide | 9 |