MSP430x11x1

MIXED SIGNAL MICROCONTROLLER

SLAS241C ± SEPTEMBER 1999 ± REVISED JUNE 2000

absolute maximum ratings²

Voltage applied at VCC to VSS (MSP430C11x1)

. . . . . ±0.3 V to 4.6

V

Voltage applied at VCC to VSS (MSP430F11x1)

. . . . . ±0.3 V to 4.1

V

Voltage applied to any pin (referenced to VSS)

±0.3 V to VCC+0.3

V

Diode current at any device terminal

. . . . . . . . . . . . ±2 mA

Storage temperature, Tstg (unprogrammed device)

. . . . ±55°C to 150°C

Storage temperature, Tstg (programmed device)

. . . . . ±40°C to 85°C

²Stresses beyond those listed under ªabsolute maximum ratingsº may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under ªrecommended operating conditionsº is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE: All voltages referenced to VSS.

recommended operating conditions

 

 

 

 

 

 

 

MIN NOM

MAX

UNITS

 

 

 

 

 

 

 

 

 

 

Supply voltage during program execution, VCC (see Note 5)

MSP430C11x1

1.8

3.6

V

 

 

 

MSP430F11x1

1.8

3.6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Supply voltage during program/erase flash memory, VCC

MSP430F11x1

2.7

3.6

V

Supply voltage, VSS

 

 

 

 

 

 

0

 

V

Operating free-air temperature range, TA

MSP430x11x1

±40

85

°C

LFXT1 crystal frequency,

LF mode selected, XTS=0

Watch crystal

32768

 

Hz

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Ceramic resonator

450

8000

 

f(LFXT1) (see Note 6)

XT1 mode selected, XTS=1

kHz

 

 

 

Crystal

1000

8000

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC = 1.8 V,

dc

2

 

 

 

 

 

 

 

MSP430x11x1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Processor frequency f(system) (MCLK signal)

VCC = 2.2 V,

dc

5

MHz

MSP430x11x1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCC = 3.6 V,

dc

8

 

 

 

 

 

 

 

MSP430x11x1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Flash timing generator frequency, f(FTG)

MSP430F11x1

257

476

kHz

Cumulative program time, segment write, t(CPT) (see Note 7)

VCC = 2.7 V/3.6 V

 

3

ms

MSP430F11x1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Low-level input voltage (TCK, TMS, TDI,

 

 

 

 

 

 

 

 

RST/NMI), VIL

VCC = 2.2 V/3 V

VSS

VSS+0.6

V

(excluding XIN, XOUT)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

High-level input voltage (TCK, TMS, TDI,

 

 

 

 

 

 

 

RST/NMI), VIH

VCC = 2.2 V/3 V

0.8VCC

VCC

V

(excluding XIN, XOUT)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input levels at XIN, XOUT

VIL(XIN, XOUT)

VCC = 2.2 V/3 V

VSS

0.2VCC

V

VIH(XIN, XOUT)

0.8VCC

VCC

 

 

 

NOTES: 5. The LFXT1 oscillator in LF-mode requires a resistor of 5.1 MΩ from XOUT to VSS when VCC <2.5 V.

 

 

The LFXT1 oscillator in XT1-mode accepts a ceramic resonator or a crystal frequency of 4 MHz at VCC

2.2 V.

 

The LFXT1 oscillator in XT1-mode accepts a ceramic resonator or a crystal frequency of 8 MHz at VCC

2.8 V.

 

6.The LFXT1 oscillator in LF-mode requires a watch crystal.

The LFXT1 oscillator in XT1-mode accepts a ceramic resonator or a crystal.

7.The cumulative program time must not be exceeded during a segment-write operation.

26

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Texas Instruments MSP430x11x1 warranty Absolute maximum ratings², Recommended operating conditions, MIN NOM MAX Units