Analog Devices ADSP-21020 manual Ordering Guide

Page 32

ADSP-21020

 

ORDERING GUIDE

 

 

 

 

 

 

 

 

 

 

Ambient Temperature

Instruction

Cycle Time

 

 

Part Number*

Range

Rate (MHz)

(ns)

Package

 

 

 

 

 

 

 

ADSP-21020KG-80

0°C to +70°C

20

50

223-Lead Ceramic Pin Grid Array

 

ADSP-21020KG-100

0°C to +70°C

25

40

223-Lead Ceramic Pin Grid Array

 

ADSP-21020KG-133

0°C to +70°C

33.3

30

223-Lead Ceramic Pin Grid Array

C1601c–5–8/94

ADSP-21020BG-80

–40°C to +85°C

20

50

223-Lead Ceramic Pin Grid Array

ADSP-21020BG-100

–40°C to +85°C

25

40

223-Lead Ceramic Pin Grid Array

 

ADSP-21020BG-120

–40°C to +85°C

30

33.3

223-Lead Ceramic Pin Grid Array

 

ADSP-21020TG-80

–55°C to +125°C

20

50

223-Lead Ceramic Pin Grid Array

 

ADSP-21020TG-100

–55°C to +125°C

25

40

223-Lead Ceramic Pin Grid Array

 

ADSP-21020TG-120

–55°C to +125°C

30

33.3

223-Lead Ceramic Pin Grid Array

 

ADSP-21020TG-80/883B

–55°C to +125°C

20

50

223-Lead Ceramic Pin Grid Array

 

ADSP-21020TG-100/883B

–55°C to +125°C

25

40

223-Lead Ceramic Pin Grid Array

 

ADSP-21020TG-120/883B

–55°C to +125°C

30

33.3

223-Lead Ceramic Pin Grid Array

 

 

 

 

 

 

 

*G = Ceramic Pin Grid Array.

PRINTED IN U.S.A.

–32–

REV. C

Image 32
Contents ADSP-21020 ADSP-21020 Address Generators and Program Sequencer Interrupts Pin Name Type Function Reset DmpageDmts ClkiinCompute If conditionIf condition Compute DMIa, Mb = dregName Description Notation MeaningItalics Fixed-Point Floating-Point MRF MRB = MRF = MRB MRF = MRF = SAT MRF = SAT MRB= MRB MRF = MRF = RND MRF = RND MRB Shifter Shifter ImmediateFixed-Point Vector Address Hex FunctionIRQ3 IRQ2Grade Parameter Min Max Unit Parameter Test Conditions Min Max UnitReset Setup before Clkin High 29 + DT/2 Timing RequirementClkin Period 150 Clkin Width HighTDTEX Clkin High to Timexp Hold after Clkin HighPulse Width TCK + FLAG3-0INSetup before Clkin High 19 + 5DT/16 FLAG3-0OUTDelay from Clkin HighClkin High to FLAG3-0OUTEnable Clkin High to FLAG3-0OUTDisableMemory Interface Disable to Low Clkin High to Memory Interface Enable 25 + DT/2Timing Requirement Hold after Clkin HighSetup before Clkin High 14 + DT/4 XTS Delay after Address, Select 28 + 7DT/8XTS Delay after Low 16 + DT/2 Switching CharacteristicXACK Delay from Address + 7DT/8 XACK Delay from XRD Low + DT/2XACK Setup before Clkin High + DT/4 XACK Hold after Clkin High Switching CharacteristicMemory Read XACK Delay from Address, Select 27 + 7DT/8 XACK Delay from XWR Low 15 + DT/2Data Setup before XWR High + DT/2 Data Disable before XWR XRD Low + 3DT/8Memory Write TDI, TMS Setup before TCK High System Inputs Setup before TCK HighPulse Width 200 160 132 120 Switching Characteristic TDO Delay from TCK LowIeee 1149.1 Test Access Port Output disable time tDIS is the difference between Output Enable/DisableCapacitive Loading Type Pins Switch ExamplePin Ptotal = Pext + 5 V 3 Iddin typ = 0.210 + 1.15 = 1.36 W3 0.1 inches Bottom View Ribbon CableADSP-21020 ADSP-21020 PGA PIN Location Name Inches Millimeters Symbol MIN MAX Ordering Guide