Cypress CY7C1917CV18, CY7C1321CV18, CY7C1319CV18, CY7C1317CV18 Boundary Scan Order, Bit # Bump ID

Page 19

CY7C1317CV18, CY7C1917CV18

CY7C1319CV18, CY7C1321CV18

Boundary Scan Order

Bit #

Bump ID

 

Bit #

Bump ID

 

Bit #

Bump ID

 

Bit #

Bump ID

0

6R

 

28

10G

 

56

6A

 

84

2J

 

 

 

 

 

 

 

 

 

 

 

1

6P

 

29

9G

 

57

5B

 

85

3K

 

 

 

 

 

 

 

 

 

 

 

2

6N

 

30

11F

 

58

5A

 

86

3J

 

 

 

 

 

 

 

 

 

 

 

3

7P

 

31

11G

 

59

4A

 

87

2K

 

 

 

 

 

 

 

 

 

 

 

4

7N

 

32

9F

 

60

5C

 

88

1K

 

 

 

 

 

 

 

 

 

 

 

5

7R

 

33

10F

 

61

4B

 

89

2L

 

 

 

 

 

 

 

 

 

 

 

6

8R

 

34

11E

 

62

3A

 

90

3L

 

 

 

 

 

 

 

 

 

 

 

7

8P

 

35

10E

 

63

1H

 

91

1M

 

 

 

 

 

 

 

 

 

 

 

8

9R

 

36

10D

 

64

1A

 

92

1L

 

 

 

 

 

 

 

 

 

 

 

9

11P

 

37

9E

 

65

2B

 

93

3N

 

 

 

 

 

 

 

 

 

 

 

10

10P

 

38

10C

 

66

3B

 

94

3M

 

 

 

 

 

 

 

 

 

 

 

11

10N

 

39

11D

 

67

1C

 

95

1N

 

 

 

 

 

 

 

 

 

 

 

12

9P

 

40

9C

 

68

1B

 

96

2M

 

 

 

 

 

 

 

 

 

 

 

13

10M

 

41

9D

 

69

3D

 

97

3P

 

 

 

 

 

 

 

 

 

 

 

14

11N

 

42

11B

 

70

3C

 

98

2N

 

 

 

 

 

 

 

 

 

 

 

15

9M

 

43

11C

 

71

1D

 

99

2P

 

 

 

 

 

 

 

 

 

 

 

16

9N

 

44

9B

 

72

2C

 

100

1P

 

 

 

 

 

 

 

 

 

 

 

17

11L

 

45

10B

 

73

3E

 

101

3R

 

 

 

 

 

 

 

 

 

 

 

18

11M

 

46

11A

 

74

2D

 

102

4R

 

 

 

 

 

 

 

 

 

 

 

19

9L

 

47

Internal

 

75

2E

 

103

4P

 

 

 

 

 

 

 

 

 

 

 

20

10L

 

48

9A

 

76

1E

 

104

5P

 

 

 

 

 

 

 

 

 

 

 

21

11K

 

49

8B

 

77

2F

 

105

5N

 

 

 

 

 

 

 

 

 

 

 

22

10K

 

50

7C

 

78

3F

 

106

5R

 

 

 

 

 

 

 

 

 

 

 

23

9J

 

51

6C

 

79

1G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

24

9K

 

52

8A

 

80

1F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

25

10J

 

53

7A

 

81

3G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

26

11J

 

54

7B

 

82

2G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

27

11H

 

55

6B

 

83

1J

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Document Number: 001-07161 Rev. *D

Page 19 of 31

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Contents Selection Guide FeaturesConfigurations Functional DescriptionCLK Logic Block Diagram CY7C1317CV18Logic Block Diagram CY7C1917CV18 DoffLogic Block Diagram CY7C1321CV18 Logic Block Diagram CY7C1319CV18BWS CY7C1917CV18 2M x Pin ConfigurationBall Fbga 13 x 15 x 1.4 mm Pinout CY7C1317CV18 2M xCY7C1321CV18 512K x CY7C1319CV18 1M xPin Name Pin Description Pin DefinitionsSynchronous Read/Write Input. When TDO for Jtag Power Supply Inputs to the Core of the DevicePower Supply Inputs for the Outputs of the Device Referenced with Respect toFunctional Overview Programmable Impedance Depth ExpansionEcho Clocks Operation Application ExampleSRAM#1 ZQ SRAM#2Comments Write Cycle DescriptionsDevice. D80 and D3518 remains unaltered Write cycle description table for CY7C1321CV18 followsDevice Into the device. D359 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode State diagram for the TAP controller follows TAP Controller State DiagramTAP Electrical Characteristics TAP Controller Block DiagramTAP Timing and Test Conditions TAP AC Switching CharacteristicsRegister Name Bit Size Identification Register DefinitionsScan Register Sizes Instruction CodesBit # Bump ID Boundary Scan OrderPower Up Sequence Power Up Sequence in DDR-II SramDLL Constraints DC Electrical Characteristics Electrical CharacteristicsMaximum Ratings Input High Voltage Vref + AC Electrical CharacteristicsInput LOW Voltage Vref Document Number 001-07161 Rev. *D Parameter Description Test Conditions Fbga Unit CapacitanceThermal Resistance Parameter Description Test Conditions Max UnitParameter Min Max DLL Timing Parameter Min Max Output TimesDON’T Care Undefined Switching WaveformsOrdering Information 250 167 Ball Fbga 13 x 15 x 1.4 mm Package DiagramWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal Information

CY7C1321CV18, CY7C1917CV18, CY7C1319CV18, CY7C1317CV18 specifications

Cypress Semiconductor Corporation, a leading provider of advanced embedded memory solutions, offers a series of high-performance SRAM (Static Random Access Memory) devices ideal for a variety of applications. Among these devices are the CY7C1317CV18, CY7C1319CV18, CY7C1917CV18, and CY7C1321CV18. These components are designed to meet the growing demands for non-volatile memory in consumer electronics, automotive systems, telecommunications, and industrial applications.

The CY7C1317CV18 and CY7C1319CV18 are both 256K-bit static RAMs with distinct features. The CY7C1317CV18 offers a dual-port architecture, enabling concurrent access from multiple sources, which substantially enhances performance in data-intensive applications. On the other hand, the CY7C1319CV18 is designed for single-port access, making it ideal for simpler applications that do not require simultaneous data reads and writes.

Further extending Cypress's SRAM portfolio, the CY7C1917CV18 provides a 2M-bit memory configuration with fast access times, high-density storage, and low power consumption. It is particularly well-suited for applications needing quick data retrieval while maintaining efficiency. The architecture of the CY7C1917CV18 allows it to be integrated seamlessly into systems requiring reliable and robust data storage.

Completing the lineup is the CY7C1321CV18, which features an innovative 1M-bit SRAM design. This SRAM is known for its low latency and high speed, making it an excellent choice for high-performance computing applications. It supports a wide operating voltage range and provides a reliable solution for volatile memory needs, especially in fast caching scenarios.

These SRAM devices utilize advanced CMOS technology to achieve high speed and low power characteristics, making them competitive choices in the market. Their robust performance ensures that they satisfy the stringent requirements of various applications, including high-speed networking, graphics processing, and instrumentation.

In terms of reliability, all four devices are built to endure challenging operating conditions and provide excellent data retention. They are offered in compact packages that facilitate easy integration into PCBs, optimizing space and enhancing design flexibility. The combination of performance, low power consumption, and scalability makes Cypress's SRAM products particularly advantageous for next-generation applications across multiple industries.