Cypress CY7C1321CV18, CY7C1319CV18, CY7C1317CV18, CY7C1917CV18 manual Parameter Min Max

Page 24

CY7C1317CV18, CY7C1917CV18

CY7C1319CV18, CY7C1321CV18

Switching Characteristics

Over the Operating Range [20, 21]

 

Cypress

Consortium

 

 

 

 

Description

300 MHz

278 MHz

250 MHz

200 MHz

167 MHz

Unit

Parameter

Parameter

 

 

 

 

Min

Max

Min

Max

Min

Max

Min

Max

Min

Max

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

POWER

 

V (Typical) to the First Access [22]

1

1

1

1

1

ms

 

 

DD

 

 

 

 

 

 

 

 

 

 

 

tCYC

tKHKH

K Clock and C Clock Cycle Time

3.3

8.4

3.6

8.4

4.0

8.4

5.0

8.4

6.0

8.4

ns

tKH

tKHKL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Clock (K/K

and C/C) HIGH

1.32

1.4

1.6

2.0

2.4

ns

tKL

tKLKH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Clock (K/K

and C/C) LOW

1.32

1.4

1.6

2.0

2.4

ns

tKHKH

tKHKH

K Clock Rise to

 

 

Clock Rise and C

1.49

1.6

1.8

2.2

2.7

ns

K

 

 

 

to C Rise (rising edge to rising edge)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tKHCH

tKHCH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

K/K

Clock Rise to C/C Clock Rise

0.00

1.45

0.00

1.55

0.00

1.8

0.00

2.2

0.00

2.7

ns

 

 

 

(rising edge to rising edge)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Setup Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tSA

tAVKH

Address Setup to K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

tSC

tIVKH

Control Setup to K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

 

 

 

(LD, R/W)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tSCDDR

tIVKH

Double Data Rate Control Setup to

0.3

0.3

0.35

0.4

0.5

ns

 

 

 

Clock (K/K) Rise

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(BWS0, BWS1,

BWS

2,

BWS

3)

 

 

 

 

 

 

 

 

 

 

 

tSD [23]

tDVKH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rise

0.3

0.3

0.35

0.4

0.5

ns

D[X:0] Setup to Clock (K/K)

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tHA

tKHAX

Address Hold after K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

tHC

tKHIX

Control

Hold after K Clock Rise

0.4

0.4

0.5

0.6

0.7

ns

 

 

 

 

 

 

(LD, R/W)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tHCDDR

tKHIX

Double Data Rate Control Hold after

0.3

0.3

0.35

0.4

0.5

ns

 

 

 

Clock (K/K) Rise

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(BWS0, BWS1,

BWS

2,

BWS

3)

 

 

 

 

 

 

 

 

 

 

 

tHD

tKHDX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rise

0.3

0.3

0.35

0.4

0.5

ns

D[X:0] Hold after Clock (K/K)

Notes

21.When a part with a maximum frequency above 167 MHz is operating at a lower clock frequency, it requires the input timings of the frequency range in which it is being operated and outputs data with the output timings of that frequency range.

22.This part has an internal voltage regulator; tPOWER is the time that the power is supplied above VDD minimum initially before a read or write operation can be initiated.

23.For DQ2 data signal on CY7C1917CV18 device, tSD is 0.5 ns for 200 MHz, 250 MHz, 278 MHz, and 300 MHz frequencies.

Document Number: 001-07161 Rev. *D

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Contents Features ConfigurationsFunctional Description Selection GuideLogic Block Diagram CY7C1317CV18 Logic Block Diagram CY7C1917CV18Doff CLKLogic Block Diagram CY7C1319CV18 Logic Block Diagram CY7C1321CV18BWS Pin Configuration Ball Fbga 13 x 15 x 1.4 mm PinoutCY7C1317CV18 2M x CY7C1917CV18 2M xCY7C1319CV18 1M x CY7C1321CV18 512K xPin Definitions Pin Name Pin DescriptionSynchronous Read/Write Input. When Power Supply Inputs to the Core of the Device Power Supply Inputs for the Outputs of the DeviceReferenced with Respect to TDO for JtagFunctional Overview Depth Expansion Programmable ImpedanceEcho Clocks Application Example SRAM#1 ZQSRAM#2 OperationWrite Cycle Descriptions CommentsWrite cycle description table for CY7C1321CV18 follows DeviceInto the device. D359 remains unaltered Device. D80 and D3518 remains unalteredIeee 1149.1 Serial Boundary Scan Jtag Idcode TAP Controller State Diagram State diagram for the TAP controller followsTAP Controller Block Diagram TAP Electrical CharacteristicsTAP AC Switching Characteristics TAP Timing and Test ConditionsIdentification Register Definitions Scan Register SizesInstruction Codes Register Name Bit SizeBoundary Scan Order Bit # Bump IDPower Up Sequence in DDR-II Sram Power Up SequenceDLL Constraints Electrical Characteristics DC Electrical CharacteristicsMaximum Ratings AC Electrical Characteristics Input High Voltage Vref +Input LOW Voltage Vref Document Number 001-07161 Rev. *D Capacitance Thermal ResistanceParameter Description Test Conditions Max Unit Parameter Description Test Conditions Fbga UnitParameter Min Max Parameter Min Max Output Times DLL TimingSwitching Waveforms DON’T Care UndefinedOrdering Information 250 167 Package Diagram Ball Fbga 13 x 15 x 1.4 mmSales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC Solutions

CY7C1321CV18, CY7C1917CV18, CY7C1319CV18, CY7C1317CV18 specifications

Cypress Semiconductor Corporation, a leading provider of advanced embedded memory solutions, offers a series of high-performance SRAM (Static Random Access Memory) devices ideal for a variety of applications. Among these devices are the CY7C1317CV18, CY7C1319CV18, CY7C1917CV18, and CY7C1321CV18. These components are designed to meet the growing demands for non-volatile memory in consumer electronics, automotive systems, telecommunications, and industrial applications.

The CY7C1317CV18 and CY7C1319CV18 are both 256K-bit static RAMs with distinct features. The CY7C1317CV18 offers a dual-port architecture, enabling concurrent access from multiple sources, which substantially enhances performance in data-intensive applications. On the other hand, the CY7C1319CV18 is designed for single-port access, making it ideal for simpler applications that do not require simultaneous data reads and writes.

Further extending Cypress's SRAM portfolio, the CY7C1917CV18 provides a 2M-bit memory configuration with fast access times, high-density storage, and low power consumption. It is particularly well-suited for applications needing quick data retrieval while maintaining efficiency. The architecture of the CY7C1917CV18 allows it to be integrated seamlessly into systems requiring reliable and robust data storage.

Completing the lineup is the CY7C1321CV18, which features an innovative 1M-bit SRAM design. This SRAM is known for its low latency and high speed, making it an excellent choice for high-performance computing applications. It supports a wide operating voltage range and provides a reliable solution for volatile memory needs, especially in fast caching scenarios.

These SRAM devices utilize advanced CMOS technology to achieve high speed and low power characteristics, making them competitive choices in the market. Their robust performance ensures that they satisfy the stringent requirements of various applications, including high-speed networking, graphics processing, and instrumentation.

In terms of reliability, all four devices are built to endure challenging operating conditions and provide excellent data retention. They are offered in compact packages that facilitate easy integration into PCBs, optimizing space and enhancing design flexibility. The combination of performance, low power consumption, and scalability makes Cypress's SRAM products particularly advantageous for next-generation applications across multiple industries.