Cypress CY7C1363C, CY7C1361C manual Ball BGA 14 x 22 x 2.4 mm

Page 29

Package Diagrams (continued)

A1 CORNER

CY7C1361C

CY7C1363C

119-Ball BGA (14 x 22 x 2.4 mm) (51-85115)

Ø0.05 M C Ø0.25 M C A B

Ø0.75±0.15(119X)

1 2 3 4 5 6 7

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

T

U

Ø1.00(3X) REF.

19.50

22.00±0.20

1.27

20.32

10.16

7 6 5 4 3 2 1

A

B

C

D

E

F

G H J K L M N P R T U

0.70 REF.

12.00

C0.25

0.90±0.05

30° TYP.

SEATING PLANE

A

2.40 MAX.

0.15 C

B

0.15(4X)

3.81

7.62

14.00±0.20

51-85115-*B

1.27

0.56

C

 

 

 

60±0.10

Document #: 38-05541 Rev. *F

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Contents Selection Guide Functional Description1 Features133 MHz 100 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1363C 512K x Logic Block Diagram CY7C1361C 256K xCY7C1363C 512K x Pin Configurations Pin Tqfp Pinout 3 Chip Enables a versionCY7C1361C 256K x CY7C1363C Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ VersionPin Configurations Ball BGA Pinout 2 Chip Enables with Jtag BWE Adsc ADV Pin Configurations Ball Fbga Pinout 3 Chip EnableCLK DQP BName Description Power supply inputs to the core of the devicePower supply for the I/O circuitry Ground for the I/O circuitry Pin DefinitionsGround for the core of the device Functional Overview Interleaved Burst Address Table Mode = Floating or VDDBurst Sequences AddressAddress Cycle Description Used ZZ Mode Electrical CharacteristicsParameter Description Test Conditions Min Max Unit Truth Table for Read/Write3 Partial Truth Table for Read/Write3Function CY7C1361C Function CY7C1363CIeee 1149.1 Serial Boundary Scan Jtag TAP Controller Block DiagramTAP Controller State Diagram TAP Instruction Set Bypass RegisterParameter Min Max Unit Clock TAP TimingOutput Times Set-up Times3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Identification Register DefinitionsIdentification Codes Scan Register SizesRegister Name Bit Size x Instruction Code DescriptionCY7C1363C 512K x Bit # Ball ID Signal Name CY7C1361C 256K x Bit # Ball ID SignalBall BGA Boundary Scan Order NameBall Fbga Boundary Scan Order CY7C1361C 256K x Bit # Ball ID Signal NameMaximum Ratings Electrical Characteristics Over the Operating Range 13Operating Range Ambient RangeThermal Resistance Capacitance15AC Test Loads and Waveforms 3V I/O Test Load133 100 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range20Read Cycle Timing22 Timing DiagramsAdsc Address GW, BWE,BWXDON’T Care Write Cycle Timing22Burst Read DON’T Care Undefined Read/Write Cycle Timing22, 24ZZ Mode Timing26 Chip Enable CY7C1363C-133AXI CY7C1361C-133AJXI Chip Enable CY7C1363C-133AXC CY7C1361C-133AJXCOrdering Information CY7C1361C-133AXCChip Enable CY7C1363C-100AXI CY7C1361C-100AJXI Chip Enable CY7C1363C-100AXC CY7C1361C-100AJXCCY7C1361C-100AXC CY7C1361C-100AXEPin Tqfp 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change