Cypress CY7C1361C, CY7C1363C Ieee 1149.1 Serial Boundary Scan Jtag, TAP Controller Block Diagram

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CY7C1361C

CY7C1363C

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1361C/CY7C1363C incorporates a serial boundary scan test access port (TAP) in the BGA package only. The TQFP package does not offer this functionality. This part operates in accordance with IEEE Standard 1149.1-1900, but doesn’t have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM. Note the TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 fully compliant TAPs. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels.

The CY7C1361C/CY7C1363C contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are inter- nally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the

Test MODE SELECT (TMS)

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most signif- icant bit (MSB) of any register. (See Tap Controller Block Diagram.)

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See Tap Controller State Diagram.)

TAP Controller Block Diagram

device.

TAP Controller State Diagram

1

TEST-LOGIC

 

 

 

 

 

RESET

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

0

RUN-TEST/

1

SELECT

1

SELECT

1

IDLE

 

DR-SCAN

 

IR-SCAN

 

 

 

 

 

 

 

 

0

 

0

 

 

 

 

1

 

1

 

 

 

 

CAPTURE-DR

 

CAPTURE-IR

 

 

 

 

0

 

0

 

 

 

 

SHIFT-DR

0

SHIFT-IR

0

 

 

 

1

 

1

 

TDI

Selection Circuitry

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31

30

29

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Register

 

 

 

 

 

 

 

 

 

 

x

.

.

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

Selection Circuitry

TDO

EXIT1-DR

1

EXIT1-IR

1

 

 

 

0

 

 

0

 

PAUSE-DR

0

PAUSE-IR

0

 

1

 

 

1

 

0

 

 

0

 

 

EXIT2-DR

 

EXIT2-IR

 

 

1

 

 

1

 

UPDATE-DR

 

UPDATE-IR

 

1

0

 

1

0

 

TCK

TMS

 

TAP CONTROLLER

 

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

The 0/1 next to each state represents the value of TMS at the rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

TAP Registers

Registers are connected between the TDI and TDO balls and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK.

Instruction Register

Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the

Document #: 38-05541 Rev. *F

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Contents Features Selection Guide Functional Description1133 MHz 100 MHz Unit Cypress Semiconductor CorporationLogic Block Diagram CY7C1361C 256K x Logic Block Diagram CY7C1363C 512K xPin Configurations Pin Tqfp Pinout 3 Chip Enables a version CY7C1361C 256K xCY7C1363C 512K x Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ Version CY7C1363CPin Configurations Ball BGA Pinout 2 Chip Enables with Jtag Pin Configurations Ball Fbga Pinout 3 Chip Enable BWE Adsc ADVCLK DQP BPower supply inputs to the core of the device Power supply for the I/O circuitryName Description Pin Definitions Ground for the core of the deviceGround for the I/O circuitry Interleaved Burst Address Table Mode = Floating or VDD Functional OverviewBurst Sequences AddressZZ Mode Electrical Characteristics Parameter Description Test Conditions Min Max UnitAddress Cycle Description Used Partial Truth Table for Read/Write3 Truth Table for Read/Write3Function CY7C1361C Function CY7C1363CTAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetTAP Timing Parameter Min Max Unit ClockOutput Times Set-up TimesTAP DC Electrical Characteristics And Operating Conditions 3V TAP AC Test Conditions5V TAP AC Test Conditions Identification Register DefinitionsScan Register Sizes Identification CodesRegister Name Bit Size x Instruction Code DescriptionCY7C1361C 256K x Bit # Ball ID Signal CY7C1363C 512K x Bit # Ball ID Signal NameBall BGA Boundary Scan Order NameCY7C1361C 256K x Bit # Ball ID Signal Name Ball Fbga Boundary Scan OrderElectrical Characteristics Over the Operating Range 13 Maximum RatingsOperating Range Ambient RangeCapacitance15 Thermal ResistanceAC Test Loads and Waveforms 3V I/O Test LoadSwitching Characteristics Over the Operating Range20 133 100 Parameter Description Unit Min MaxTiming Diagrams Read Cycle Timing22Adsc Address GW, BWE,BWXWrite Cycle Timing22 DON’T CareRead/Write Cycle Timing22, 24 Burst Read DON’T Care UndefinedZZ Mode Timing26 Chip Enable CY7C1363C-133AXC CY7C1361C-133AJXC Chip Enable CY7C1363C-133AXI CY7C1361C-133AJXIOrdering Information CY7C1361C-133AXCChip Enable CY7C1363C-100AXC CY7C1361C-100AJXC Chip Enable CY7C1363C-100AXI CY7C1361C-100AJXICY7C1361C-100AXC CY7C1361C-100AXEPackage Diagrams Pin Tqfp 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History