Cypress CY7C1361C, CY7C1363C ZZ Mode Electrical Characteristics, Address Cycle Description Used

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CY7C1361C

CY7C1363C

ZZ Mode Electrical Characteristics

Parameter

Description

 

 

 

 

 

 

 

Test Conditions

 

 

 

 

 

Min.

 

 

 

Max.

Unit

IDDZZ

Sleep mode standby current

 

 

 

ZZ > VDD – 0.2V

 

 

 

Comm/ind’l

 

 

 

 

 

50

 

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Automotive

 

 

 

 

 

60

 

mA

tZZS

Device operation to ZZ

 

 

 

ZZ > VDD – 0.2V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2tCYC

ns

tZZREC

ZZ recovery time

 

 

 

 

 

ZZ < 0.2V

 

 

 

 

 

 

 

 

 

 

 

 

2tCYC

 

 

 

 

 

ns

tZZI

ZZ active to sleep current

 

 

 

This parameter is sampled

 

 

 

 

 

 

 

 

 

 

 

 

2tCYC

ns

tRZZI

ZZ Inactive to exit sleep current

 

This parameter is sampled

 

 

 

 

 

 

0

 

 

 

 

 

 

 

ns

Truth Table [3, 4, 5, 6, 7]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Address

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cycle Description

Used

 

CE

1

CE2

 

CE

3

ZZ

 

ADSP

 

 

ADSC

 

 

ADV

 

 

WRITE

 

 

OE

 

CLK

 

DQ

Deselected Cycle, Power-down

None

 

H

 

X

 

X

L

 

X

 

 

 

L

 

 

X

 

X

 

X

 

L-H

 

Tri-state

Deselected Cycle, Power-down

None

 

L

 

L

 

X

L

 

L

 

 

 

X

 

 

X

 

X

 

X

 

L-H

 

Tri-state

Deselected Cycle, Power-down

None

 

L

 

X

 

H

L

 

L

 

 

 

X

 

 

X

 

X

 

X

 

L-H

 

Tri-state

Deselected Cycle, Power-down

None

 

L

 

L

 

X

L

 

H

 

 

 

L

 

 

X

 

X

 

X

 

L-H

 

Tri-state

Deselected Cycle, Power-down

None

 

X

 

X

 

X

L

 

H

 

 

 

L

 

 

X

 

X

 

X

 

L-H

 

Tri-state

Sleep Mode, Power-down

None

 

X

 

X

 

X

H

 

X

 

 

 

X

 

 

X

 

X

 

X

 

X

 

Tri-state

Read Cycle, Begin Burst

External

 

L

 

H

 

L

L

 

L

 

 

 

X

 

 

X

 

X

 

L

 

L-H

 

Q

Read Cycle, Begin Burst

External

 

L

 

H

 

L

L

 

L

 

 

 

X

 

 

X

 

X

 

H

 

L-H

 

Tri-state

Write Cycle, Begin Burst

External

 

L

 

H

 

L

L

 

H

 

 

 

L

 

 

X

 

L

 

X

 

L-H

 

D

Read Cycle, Begin Burst

External

 

L

 

H

 

L

L

 

H

 

 

 

L

 

 

X

 

H

 

L

 

L-H

 

Q

Read Cycle, Begin Burst

External

 

L

 

H

 

L

L

 

H

 

 

 

L

 

 

X

 

H

 

H

 

L-H

 

Tri-state

Read Cycle, Continue Burst

Next

 

X

 

X

 

X

L

 

H

 

 

 

H

 

 

L

 

H

 

L

 

L-H

 

Q

Read Cycle, Continue Burst

Next

 

X

 

X

 

X

L

 

H

 

 

 

H

 

 

L

 

H

 

H

 

L-H

 

Tri-state

Read Cycle, Continue Burst

Next

 

H

 

X

 

X

L

 

X

 

 

 

H

 

 

L

 

H

 

L

 

L-H

 

Q

Read Cycle, Continue Burst

Next

 

H

 

X

 

X

L

 

X

 

 

 

H

 

 

L

 

H

 

H

 

L-H

 

Tri-state

Write Cycle, Continue Burst

Next

 

X

 

X

 

X

L

 

H

 

 

 

H

 

 

L

 

L

 

X

 

L-H

 

D

Write Cycle, Continue Burst

Next

 

H

 

X

 

X

L

 

X

 

 

 

H

 

 

L

 

L

 

X

 

L-H

 

D

Read Cycle, Suspend Burst

Current

 

X

 

X

 

X

L

 

H

 

 

 

H

 

 

H

 

H

 

L

 

L-H

 

Q

Read Cycle, Suspend Burst

Current

 

X

 

X

 

X

L

 

H

 

 

 

H

 

 

H

 

H

 

H

 

L-H

 

Tri-state

Read Cycle, Suspend Burst

Current

 

H

 

X

 

X

L

 

X

 

 

 

H

 

 

H

 

H

 

L

 

L-H

 

Q

Read Cycle, Suspend Burst

Current

 

H

 

X

 

X

L

 

X

 

 

 

H

 

 

H

 

H

 

H

 

L-H

 

Tri-state

Write Cycle, Suspend Burst

Current

 

X

 

X

 

X

L

 

H

 

 

 

H

 

 

H

 

L

 

X

 

L-H

 

D

Write Cycle, Suspend Burst

Current

 

H

 

X

 

X

L

 

X

 

 

 

H

 

 

H

 

L

 

X

 

L-H

 

D

Notes:

3.X=”Don't Care.” H = Logic HIGH, L = Logic LOW.

4.WRITE = L when any one or more Byte Write enable signals and BWE = L or GW = L. WRITE = H when all Byte write enable signals, BWE, GW = H.

5.The DQ pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.

6.The SRAM always initiates a read cycle when ADSP is asserted, regardless of the state of GW, BWE, or BWX. Writes may occur only on subsequent clocks after the ADSP or with the assertion of ADSC. As a result, OE must be driven HIGH prior to the start of the write cycle to allow the outputs to tri-state. OE is a don't care for the remainder of the write cycle.

7.OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle all data bits are tri-state when OE is inactive or when the device is deselected, and all data bits behave as output when OE is active (LOW).

Document #: 38-05541 Rev. *F

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Contents 133 MHz 100 MHz Unit FeaturesSelection Guide Functional Description1 Cypress Semiconductor CorporationLogic Block Diagram CY7C1361C 256K x Logic Block Diagram CY7C1363C 512K xCY7C1361C 256K x Pin Configurations Pin Tqfp Pinout 3 Chip Enables a versionCY7C1363C 512K x Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ Version CY7C1363CPin Configurations Ball BGA Pinout 2 Chip Enables with Jtag CLK Pin Configurations Ball Fbga Pinout 3 Chip EnableBWE Adsc ADV DQP BPower supply for the I/O circuitry Power supply inputs to the core of the deviceName Description Ground for the core of the device Pin DefinitionsGround for the I/O circuitry Burst Sequences Interleaved Burst Address Table Mode = Floating or VDDFunctional Overview AddressParameter Description Test Conditions Min Max Unit ZZ Mode Electrical CharacteristicsAddress Cycle Description Used Function CY7C1361C Partial Truth Table for Read/Write3Truth Table for Read/Write3 Function CY7C1363CTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetOutput Times TAP TimingParameter Min Max Unit Clock Set-up Times5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Identification Register DefinitionsRegister Name Bit Size x Scan Register SizesIdentification Codes Instruction Code DescriptionBall BGA Boundary Scan Order CY7C1361C 256K x Bit # Ball ID SignalCY7C1363C 512K x Bit # Ball ID Signal Name NameCY7C1361C 256K x Bit # Ball ID Signal Name Ball Fbga Boundary Scan OrderOperating Range Electrical Characteristics Over the Operating Range 13Maximum Ratings Ambient RangeAC Test Loads and Waveforms Capacitance15Thermal Resistance 3V I/O Test LoadSwitching Characteristics Over the Operating Range20 133 100 Parameter Description Unit Min MaxAdsc Address Timing DiagramsRead Cycle Timing22 GW, BWE,BWXWrite Cycle Timing22 DON’T CareRead/Write Cycle Timing22, 24 Burst Read DON’T Care UndefinedZZ Mode Timing26 Ordering Information Chip Enable CY7C1363C-133AXC CY7C1361C-133AJXCChip Enable CY7C1363C-133AXI CY7C1361C-133AJXI CY7C1361C-133AXCCY7C1361C-100AXC Chip Enable CY7C1363C-100AXC CY7C1361C-100AJXCChip Enable CY7C1363C-100AXI CY7C1361C-100AJXI CY7C1361C-100AXEPackage Diagrams Pin Tqfp 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History