Cypress CY7C1363C, CY7C1361C manual Name Description, Power supply inputs to the core of the device

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CY7C1361C

 

Pin Definitions

 

 

 

 

 

 

 

 

 

 

 

 

CY7C1363C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Name

I/O

 

 

Description

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A0, A1, A

Input-

Address Inputs used to select one of the address locations. Sampled at the rising

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

edge of the CLK if ADSP or ADSC is active LOW, and CE , CE , and CE [2] are sampled

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

2

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

active. A[1:0] feed the 2-bit counter.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

A,

 

 

 

B

Input-

Byte Write Select Inputs, active LOW. Qualified with

 

to conduct byte writes to the

 

 

BW

BW

BWE

 

 

BWC,BWD

Synchronous

SRAM. Sampled on the rising edge of CLK.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a

 

 

GW

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

global write is conducted (ALL bytes are written, regardless of the values on

BW

X and BWE).

 

 

CLK

Input-

Clock Input. Used to capture all synchronous inputs to the device. Also used to increment

 

 

 

 

 

 

 

 

 

 

 

 

 

Clock

the burst counter when ADV is asserted LOW, during a burst operation.

 

 

 

 

 

 

1

 

 

 

 

Input-

Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in

 

 

 

 

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

conjunction with CE

and CE [2] to select/deselect the device. ADSP is ignored if

CE

1

is

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

HIGH. CE1 is sampled only when a new external address is loaded.

 

 

 

 

 

 

 

 

 

CE2

Input-

Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

conjunction with CE1 and CE3[2] to select/deselect the device. CE2 is sampled only when

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

a new external address is loaded.

 

 

 

 

 

 

 

 

 

 

 

 

 

3[2]

 

 

Input-

Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in

 

 

 

 

 

CE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

conjunction with CE1 and CE2 to select/deselect the device.CE3 is sampled only when a

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

new external address is loaded.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins.

 

 

OE

 

 

 

 

 

 

 

 

 

 

 

 

 

Asynchronous

When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tri-stated, and act as input data pins. OE is masked during the first clock of a read cycle

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

when emerging from a deselected state.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Advance Input signal, sampled on the rising edge of CLK. When asserted, it automat-

 

 

ADV

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

ically increments the address in a burst cycle.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Address Strobe from Processor, sampled on the rising edge of CLK, active LOW.

 

 

ADSP

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

When asserted LOW, addresses presented to the device are captured in the address

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

registers. A[1:0]

are also loaded into the burst counter. When ADSP and ADSC are both

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

asserted, only ADSP is recognized. ASDP is ignored when

CE

1 is deasserted HIGH.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Address Strobe from Controller, sampled on the rising edge of CLK, active LOW.

 

 

ADSC

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

When asserted LOW, addresses presented to the device are captured in the address

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

registers. A[1:0]

are also loaded into the burst counter. When ADSP and ADSC are both

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

asserted, only ADSP is recognized.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal

 

 

BWE

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

must be asserted LOW to conduct a byte write.

 

 

 

 

 

 

 

 

 

 

 

 

ZZ

Input-

ZZ “sleep” Input, active HIGH. When asserted HIGH places the device in a

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Asynchronous

non-time-critical “sleep” condition with data integrity preserved. For normal operation,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

this pin has to be LOW or left floating. ZZ pin has an internal pull-down.

 

 

 

 

 

DQs

I/O-

Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

triggered by the rising edge of CLK. As outputs, they deliver the data contained in the

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

memory location specified by the addresses presented during the previous clock rise of

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the read cycle. The direction of the pins is controlled by OE. When OE is asserted LOW,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the pins behave as outputs. When HIGH, DQs and DQPX are placed in a tri-state

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

condition.The outputs are automatically tri-stated during the data portion of a write

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

sequence, during the first clock when emerging from a deselected state, and when the

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

device is deselected, regardless of the state of

OE.

 

 

 

 

 

 

 

 

 

 

 

 

 

DQPX

I/O-

Bidirectional Data Parity I/O Lines. Functionally, these signals are identical to DQs.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Synchronous

During write sequences, DQPX is controlled by BWX correspondingly.

 

 

 

 

 

MODE

Input-

Selects Burst Order. When tied to GND selects linear burst sequence. When tied to VDD

 

 

 

 

 

 

 

 

 

 

 

 

 

Static

or left floating selects interleaved burst sequence. This is a strap pin and should remain

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

static during device operation. Mode Pin has an internal pull-up.

 

 

 

 

 

 

 

 

 

VDD

Power Supply

Power supply inputs to the core of the device.

 

 

 

 

 

 

 

 

 

 

 

 

VDDQ

I/O Power Supply

Power supply for the I/O circuitry.

 

 

 

 

 

 

 

 

 

 

Document #: 38-05541 Rev. *F

 

 

 

 

 

 

 

 

 

 

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Contents Cypress Semiconductor Corporation FeaturesSelection Guide Functional Description1 133 MHz 100 MHz UnitLogic Block Diagram CY7C1363C 512K x Logic Block Diagram CY7C1361C 256K xCY7C1361C 256K x Pin Configurations Pin Tqfp Pinout 3 Chip Enables a versionCY7C1363C 512K x CY7C1363C Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ VersionPin Configurations Ball BGA Pinout 2 Chip Enables with Jtag DQP B Pin Configurations Ball Fbga Pinout 3 Chip EnableBWE Adsc ADV CLKPower supply for the I/O circuitry Power supply inputs to the core of the deviceName Description Ground for the core of the device Pin DefinitionsGround for the I/O circuitry Address Interleaved Burst Address Table Mode = Floating or VDDFunctional Overview Burst SequencesParameter Description Test Conditions Min Max Unit ZZ Mode Electrical CharacteristicsAddress Cycle Description Used Function CY7C1363C Partial Truth Table for Read/Write3Truth Table for Read/Write3 Function CY7C1361CTAP Controller State Diagram TAP Controller Block DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterSet-up Times TAP TimingParameter Min Max Unit Clock Output TimesIdentification Register Definitions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions 5V TAP AC Test ConditionsInstruction Code Description Scan Register SizesIdentification Codes Register Name Bit Size xName CY7C1361C 256K x Bit # Ball ID SignalCY7C1363C 512K x Bit # Ball ID Signal Name Ball BGA Boundary Scan OrderBall Fbga Boundary Scan Order CY7C1361C 256K x Bit # Ball ID Signal NameAmbient Range Electrical Characteristics Over the Operating Range 13Maximum Ratings Operating Range3V I/O Test Load Capacitance15Thermal Resistance AC Test Loads and Waveforms133 100 Parameter Description Unit Min Max Switching Characteristics Over the Operating Range20GW, BWE,BWX Timing DiagramsRead Cycle Timing22 Adsc AddressDON’T Care Write Cycle Timing22Burst Read DON’T Care Undefined Read/Write Cycle Timing22, 24ZZ Mode Timing26 CY7C1361C-133AXC Chip Enable CY7C1363C-133AXC CY7C1361C-133AJXCChip Enable CY7C1363C-133AXI CY7C1361C-133AJXI Ordering InformationCY7C1361C-100AXE Chip Enable CY7C1363C-100AXC CY7C1361C-100AJXCChip Enable CY7C1363C-100AXI CY7C1361C-100AJXI CY7C1361C-100AXCPin Tqfp 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change