Motorola I580 service manual Preparing for Field Level Testing Remove Flip Assembly

PREPARING FOR FIELD LEVEL TESTING: Remove Flip Assembly

4.While carefully pushing the black stick in towards the flip assembly about 2mm, twist the stick as if you were tightening a screw.

5.Try to compress the hinge spring by moving the stick in a shoveling motion. The front housing will deflect slightly, allowing the hinge to release the right side from the front housing.

6.Once the Flip Assembly is free of the front housing, carefully feed the Flex Connector through the slot in the front housing. Take extra precaution to prevent stressing and/or tearing the Flex Ribbon.

7.Angle the flex connector end slightly while prodding the flex ribbon out through front housing slot. The flex connector will pass through the slot, albeit tightly.

8.Remove the Hinge Assembly Mechanism by inserting the tip of the black stick into the flex guard slot and pushing on the hinge assembly tip until it pops out.

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8

Figure 7-9.

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