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| AD9912 | |
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THERMAL PERFORMANCE |
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Table 7. Thermal Parameters |
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Symbol | Thermal Characteristic Using a | Value |
| Unit |
θJA | 25.2 |
| °C/W | |
θJMA | 22.0 |
| °C/W | |
θJMA | 19.8 |
| °C/W | |
θJB | 13.9 |
| °C/W | |
θJC | 1.7 |
| °C/W | |
ΨJT | 0.1 |
| °C/W |
The AD9912 is specified for a case temperature (TCASE). To ensure that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera- ture on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by customer at top center of package.
ΨJT is the value from Table 7.
PD is the power dissipation (see the Total Power Dissipation section in the Specifications section).
Values of θJA are provided for package comparison and PCB design considerations. θJA can be used for a
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB design considerations.
The values in Table 7 apply to both
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