CY7C68013A, CY7C68014A

CY7C68015A, CY7C68016A

14. Quad Flat Package No Leads (QFN) Package Design Notes

Electrical contact of the part to the Printed Circuit Board (PCB) is made by soldering the leads on the bottom surface of the package to the PCB. Hence, special attention is required to the heat transfer area below the package to provide a good thermal bond to the circuit board. Design a Copper (Cu) fill in the PCB as a thermal pad under the package. Heat is transferred from the FX2LP through the device’s metal paddle on the bottom side of the package. Heat from here is conducted to the PCB at the thermal pad. It is then conducted from the thermal pad to the PCB inner ground plane by a 5 x 5 array of via. A via is a plated through hole in the PCB with a finished diameter of 13 mil. The QFN’s metal die paddle must be soldered to the PCB’s thermal pad. Solder mask is placed on the board top side over each via to resist solder flow into the via. The mask on the top side also minimizes outgassing during the solder reflow process.

For further information on this package design refer to Appli- cation Notes for Surface Mount Assembly of Amkor's MicroLead- Frame (MLF) Packages. You can find this on Amkor's website http://www.amkor.com.

The application note provides detailed information about board mounting guidelines, soldering flow, rework process, etc.

Figure 40 shows a cross-sectional area underneath the package. The cross section is of only one via. The solder paste template should be designed to allow at least 50% solder coverage. The thickness of the solder paste template should be

5mil. Use the No Clean type 3 solder paste for mounting the part. Nitrogen purge is recommended during reflow.

Figure 41 is a plot of the solder mask pattern and Figure 42 displays an X-Ray image of the assembly (darker areas indicate solder).

Figure 40. Cross-section of the Area Underneath the QFN Package

0.017” dia

Solder Mask

Cu Fill

Cu Fill

PCB Material

Via hole for thermally connecting the QFN to the circuit board ground plane.

0.013” dia

PCB Material

This figure only shows the top three layers of the circuit board: Top Solder, PCB Dielectric, and the Ground Plane

Figure 41. Plot of the Solder Mask (White Area)

Figure 42. X-ray Image of the Assembly

Document #: 38-08032 Rev. *L

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Cypress CY7C68013A manual Quad Flat Package No Leads QFN Package Design Notes
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CY7C68013A specifications

The Cypress CY7C68013A is a high-performance USB microcontroller that belongs to Cypress's FX2LP family, specifically designed for USB applications. This microcontroller is well-regarded for its versatility, making it a popular choice for developers engaged in USB-enabled projects.

One of the main features of the CY7C68013A is its ability to support USB 2.0, with both high-speed (480 Mbps) and full-speed (12 Mbps) operation. This capability allows developers to take full advantage of the USB interface for data transfer, making it suitable for applications that require fast and efficient data communication. The device integrates a USB controller along with an 8051-compatible microcontroller, providing a seamless interface for USB transactions while also allowing for custom processing tasks.

The CY7C68013A offers 32 KB of internal RAM, which is a valuable resource for data buffering and temporary storage during data transfer operations. Additionally, it includes a programmable 8-bit I/O interface, which can be tailored to various application needs, facilitating control over peripheral devices. The microcontroller also features a 16-bit address bus and a 16-bit data bus, enhancing its ability to interface with external memory and components.

In terms of development, moving from concept to production becomes easier due to the availability of development kits and software support. The CY7C68013A is compatible with Cypress's EZ-USB development environment, which includes APIs and libraries that simplify the coding process. This software support empowers developers to create sophisticated USB-related applications without needing extensive background knowledge in USB protocol intricacies.

Regarding power efficiency, the CY7C68013A operates at low power consumption levels, making it suitable for battery-operated devices. It supports various low-power modes, which further enhances its appeal for portable applications.

Overall, the Cypress CY7C68013A stands out for its robust features, flexibility, and ease of use, making it an ideal choice for engineers working on USB-centric designs. Its combination of high-speed USB functionality, ample internal resources, and strong software support positions it as a go-to microcontroller for a wide variety of applications, ranging from consumer electronics to industrial systems.
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