Epson S1C63558 CHAPTER 9 PAD LAYOUT, 9.1 Diagram of Pad Layout, EPSON, Pad opening: 100 µm, CHAPTER 9: PAD LAYOUT, Chip thickness: 400 µm

CHAPTER 9: PAD LAYOUT

CHAPTER 9 PAD LAYOUT

9.1 Diagram of Pad Layout

30	25	20	15	10	5	1
							122
						Die No.
						120
35
						115
40
			Y			110
45				X
			(0, 0)
						105
50
						100
55
						95
60
	65	70	75	80	85	90
			4.01 mm

4.50 mm

Chip thickness: 400 µmPad opening: 100 µm

S1C63558 TECHNICAL MANUAL EPSON 171