Contents

5 Identifying the Chassis, Routine Care, and Disassembly Preparation

5.1 Chassis Designations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1 5.1.1 Microtower (MT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

5.2 Electrostatic Discharge Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3 5.2.1 Generating Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3 5.2.2 Preventing Electrostatic Damage to Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3 5.2.3 Personal Grounding Methods and Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4 5.2.4 Grounding the Work Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4 5.2.5 Recommended Materials and Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4

5.3 Routine Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5 5.3.1 General Cleaning Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5 5.3.2 Cleaning the Computer Case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5 5.3.3 Cleaning the Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6 5.3.4 Cleaning the Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6 5.3.5 Cleaning the Mouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6

5.4 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.4.1 Tools and Software Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.4.2 Screws. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.4.3 Cables and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8 5.4.4 Hard Drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8 5.4.5 Lithium Coin Cell Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8

6 Removal and Replacement Procedures—Microtower (MT) Chassis

6.1

Preparation for Disassembly

. 6–1

6.2

Remove the computer access panel and front bezel (MT chassis)

. 6–2

 

6.2.1 Access Panel (MT Chassis)

. 6–2

 

6.2.2 Front Bezel (MT Chassis)

. 6–3

6.3

Front Drive Bezels

. 6–4

 

6.3.1 Removing a 5.25" Drive Bezel Blank/MT Chassis

. 6–4

6.4

Memory

. 6–5

 

6.4.1 Installing Memory Modules/MT chassis

. 6–5

6.5

Expansion Cards

. 6–6

 

6.5.1 Expansion Slot Cover Lock

. 6–6

 

6.5.2

PCI/PCIe Expansion Card

. 6–7

 

6.5.3 Installing an Expansion Card

. 6–8

 

6.5.4 Removing an Expansion Card

6–10

6.6

Cable Management

6–11

6.7

Drives

6–12

 

6.7.1

Locating Drive Positions

6–12

 

6.7.2

Removing a Drive

6–13

6.8

Front I/O Panel Housing Assembly - MT chassis

6–17

6.9

System Fan

6–18

6.10

Heatsink - MT chassis

6–19

6.11

Processor

6–20

6.12

System Board

6–22

6.13

Battery

6–23

 

6.13.1Battery Holder

6–24

6.14

Power Supply

6–25

iv

490778-001

Service Reference Guide

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HP dx2310 manual Removal and Replacement Procedures-Microtower MT Chassis

dx2310 specifications

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