HP dx2310 manual Identifying the Chassis, Routine Care, and Disassembly Preparation

Contents

5 Identifying the Chassis, Routine Care, and Disassembly Preparation

5.1 Chassis Designations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1 5.1.1 Microtower (MT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

5.2 Electrostatic Discharge Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3 5.2.1 Generating Static . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3 5.2.2 Preventing Electrostatic Damage to Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3 5.2.3 Personal Grounding Methods and Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4 5.2.4 Grounding the Work Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4 5.2.5 Recommended Materials and Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4

5.3 Routine Care . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5 5.3.1 General Cleaning Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5 5.3.2 Cleaning the Computer Case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–5 5.3.3 Cleaning the Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6 5.3.4 Cleaning the Monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6 5.3.5 Cleaning the Mouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–6

5.4 Service Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.4.1 Tools and Software Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.4.2 Screws. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–7 5.4.3 Cables and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8 5.4.4 Hard Drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8 5.4.5 Lithium Coin Cell Battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8

6 Removal and Replacement Procedures—Microtower (MT) Chassis

6.1	Preparation for Disassembly		. 6–1
6.2	Remove the computer access panel and front bezel (MT chassis)		. 6–2
	6.2.1 Access Panel (MT Chassis)		. 6–2
	6.2.2 Front Bezel (MT Chassis)		. 6–3
6.3	Front Drive Bezels		. 6–4
	6.3.1 Removing a 5.25" Drive Bezel Blank/MT Chassis		. 6–4
6.4	Memory		. 6–5
	6.4.1 Installing Memory Modules/MT chassis		. 6–5
6.5	Expansion Cards		. 6–6
	6.5.1 Expansion Slot Cover Lock		. 6–6
	6.5.2	PCI/PCIe Expansion Card	. 6–7
	6.5.3 Installing an Expansion Card		. 6–8
	6.5.4 Removing an Expansion Card		6–10
6.6	Cable Management		6–11
6.7	Drives		6–12
	6.7.1	Locating Drive Positions	6–12
	6.7.2	Removing a Drive	6–13
6.8	Front I/O Panel Housing Assembly - MT chassis		6–17
6.9	System Fan		6–18
6.10	Heatsink - MT chassis		6–19
6.11	Processor		6–20
6.12	System Board		6–22
6.13	Battery		6–23
	6.13.1Battery Holder		6–24
6.14	Power Supply		6–25

iv 490778-001 Service Reference Guide