EM78P259N/260N

8-Bit Microprocessor with OTP ROM

APPENDIX

A

Package Type

 

 

 

 

 

 

 

 

 

 

 

 

 

OTP MCU

Package Type

Pin Count

Package Size

 

 

 

EM78P259NPS/NPJ

DIP

18

300mil

 

 

 

 

 

 

 

 

 

 

EM78P259NMS/NMJ

SOP

18

300mil

 

 

 

 

 

 

 

 

 

 

EM78P260NPS/NPJ

DIP

20

300mil

 

 

 

 

 

 

 

 

 

 

EM78P260NMS/NMJ

SOP

20

300mil

 

 

 

 

 

 

 

 

 

 

EM78P260NKMS/NKMJ

SSOP

20

209mil

 

 

 

 

 

 

 

 

 

 

 

 

 

B

Package Information

 

 

 

B.1 18-Lead Plastic Dual in line (PDIP) 300 mil

 

Symbal

Min

Normal

Max

 

A

 

 

4.450

 

A1

0.381

 

 

 

A2

3.175

3.302

3.429

 

c

0.203

0.254

0.356

 

D

22.610

22.860

23.110

 

E1

6.220

6.438

6.655

 

E

7.370

7.620

7.870

 

eB

8.510

9.020

9.530

 

B

0.356

0.457

0.559

eB

B1

1.143

1.524

1.778

 

L

3.048

3.302

3.556

 

e

 

2.540(TYP)

θ

θ

0

 

15

 

TITLE:

 

 

 

PDIP-18L 300MIL PACKAGE

 

OUTLINE DIMENSION

 

 

File :

D18

Edtion: A

 

 

 

 

Unit : mm

 

 

 

 

 

 

Scale: Free

 

 

 

Material:

 

 

 

Sheet:1 of 1

78 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

Page 84
Image 84
IBM EM78P259N/260N manual Package Type, Package Information, Lead Plastic Dual in line Pdip 300 mil