Intel NetStructure® MPCBL0001 High Performance Single Board Computer 5
Technical Product Specification
Contents
4 Connectors .............................................................................................................. ......................70
4.1 Backplane Connectors........................................................................................ ................74
4.1.1 Power Distribution Connector (Zone 1).................................................................. 74
4.1.2 Data Transport Connector (Zone 2)....................................................................... 75
4.1.3 Alignment Blocks ................................................................................................... 76
4.2 Front Panel Connectors................................................... ...................................................77
4.2.1 USB Connector (J12)................................................................................ .............77
4.2.2 Serial Port Connector (J17) ...................................................................................77
4.2.3 Fibre Channel Small Form-Factor Pluggable (SFP) Receptacle (J34 and J35) ....80
4.2.4 Fibre Channel SFP Optical Transceiver Module.................................................... 80
4.2.5 PMC Connectors (J25, J26, J27)........................................................................... 81
4.3 On-board Connectors ......................................................................................................... 84
4.3.1 IDE Connector (J24).......... ....................................................................................84
5 Addressing.................................................................................. ...................................................85
5.1 Configuration Registers ......................................................................................................85
5.1.1 Configuration Address Register MCH CONFIG_ADDRESS .................................85
5.1.2 Configuration Data Register MCH CONFIG_ADDRESS............................. ..........85
5.2 I/O Address Assignments ................................................................................................... 86
5.3 Memory Map....................................................... ................................................................87
5.4 IPMC Addresses.................................................... .............................................................88
6 Specifications .......................................................................................................... ......................89
6.1 Mechanical Specifications .................................................................................................. 89
6.1.1 Board Outline.................................................. .......................................................89
6.1.2 Backing Plate............................................... ..........................................................92
6.1.3 Component Height.............................................. ...................................................92
6.2 Environmental Specifications................................................................................. .............97
6.3 Reliability Specifications ..................................................................................................... 97
6.3.1 Mean Time Between Failure (MTBF) Specifications..............................................97
6.3.1.1 Environmental Assumptions ..................................................................98
6.3.1.2 General Assumptions............................................................................. 98
6.3.1.3 General Notes..................................................................... ...................98
6.3.2 Power Consumption .............................................................................................. 98
6.3.3 Cooling Requirements ........................................................................................... 99
6.4 Board Layer Specifications.................... .............................................................................99
6.5 Weight.................................................................................... .............................................99
7 BIOS Features.................................................. ...........................................................................100
7.1 Introduction........................ ................................................................................. ..............100
7.2 BIOS Flash Memory Organization............... .....................................................................100
7.3 Complementary Metal-Oxide Semiconductor (CMOS)............................................. ........100
7.3.1 Copying and Saving CMOS Settings.................................................. .................100
7.4 Redundant BIOS Functionality ......................................................................................... 101
7.5 System Management BIOS (SMBIOS)..................................... ........................................101
7.6 Legacy USB Support ........................................................................................................ 102
7.7 BIOS Updates.............................................. .....................................................................102
7.7.1 Language Support ............................................................................................... 103
7.8 Recovering BIOS Data ..................................................................................................... 103
7.9 Boot Options.......................... ...........................................................................................103