MPCMM0002
Material Declaration Data Sheet
Intel NetStructure® MPCMM0002 ATCA Chassis Management Module | Product Weight (grams): | 561.7 | |
MPCMM0002Q |
| Manufacturer: | Intel Corporation |
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| revised: | 4/3/2006 |
Pb Free Product: | yes |
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Restriction on Hazardous Substances (RoHS) Compliance
RoHS Definition
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Quantity limit of 0.1% by mass (1000 PPM) for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE)
*Quantity limit of 0.01% by mass (100 PPM) for: Cadmium
Intel understands RoHS requires: Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the
EU or (2) an approved/pending exemption applies. (Note: RoHS implementing details are not fully defined and may change.)
RoHS Declaration | Select the appropriate RoHS Declaration(s) from below. |
The part does not contain RoHS restricted substances per the definition above.
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in optical and filter glass.
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications.
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in high melting temperature type solders (i.e. tin- lead sloder alloys containing more than 85% lead).
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in electronic ceramic parts
The part does contain RoHS substances per the definition above and uses the following exemption: Lead in glass of electronic components.
This part contains RoHS restricted materials (lead) above the threshold level. Exemption status cannot be determined since this part may be used in exempt and/or
Other: Lead used in compliant pin connector systems
Where the part is declared to meet RoHS requirements, it has been verified to be in conformance with 2002/95/EC as we currently understand the requirements. Intel has systems in place to verify conformance with all applicable environmental requirements and to the best of our knowledge the information is true and correct.
LEVEL A MATERIALS AND SUBSTANCES
Materials from Annex A of the EIA/EICTA/JGPSSI Material Composition Declaration Guide and listed in the table below are not contained in this product in quantities above the threshold level for these materials as stated in the EIA/EICTA/JGPSSI Material Composition Declaration Guide, nor intentionally added to this product.
Asbestos | Mercury/Mercury Compounds | Polychlorinated Naphthalenes |
Azo colorants | Ozone Depleting Substances | Radioactive Substances |
Cadmium /Cadmium Compounds | Polybrominated Biphenyls (PBBs) | Shortchain Chlorinated Paraffins |
Hexavalent Chromium | Polybrominated Diphenylethers (PBDEs) | Tributyl Tin (TBT) and Triphenyl Tin (TPT) |
Hexavalent Chromium Compounds | Polychlorinated Biphenyls (PCBs) | Tributyl Tin Oxide (TBTO) |
This product contains no lead/lead compounds.
Description of Use
Location in Product
Material Concentration (ppm)
LEVEL B MATERIALS AND SUBSTANCES
Antimony/Antimony Compounds | Bismuth/Bismuth Compounds |
Arsenic/Arsenic Compounds | Brominated Flame Retardants |
Beryllium/Beryllium Compounds | Nickel/Nickel Compounds |
If this product contains materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm those materials/substances are listed below.
| Material / Substance | Description of Use | Location in Product | Material Concentration (ppm) |
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| Nickel | Plating | Board top and back plates, | 5500 |
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COMMENTS
1 The data on Level A and B materials and substances are based on analytical testing of the following product: MPCMM0002QBPP
Individual unit test results may vary due to differences in production and /or sensitivities of analytical testing methods. Data shown on this MDDS reflect
2This data sheet is based on the product specified and other products within the family are similar.
3Data in parts per million (ppm) can be used to estimate content for other products within this family.
4Material mass can be estimated by multiplying concentration (ppm) by product weight.
5The remainder of this package consists of
INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO THIS MDDS. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USER'S OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS MDDS THAT HAS BEEN UPDATED OR CHANGED.
Intel NetStructure® MPCMM0002 Chassis Management Module |
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Hardware TPS | July 2007 |
76 | Order Number: |
