MPCMM0002 CMM—Thermals
Figure 30. Side-to-Side Air Flow
The MPCMM0002 CMM module supports a front-to-back airflow path as well. This is most useful when the CMM is installed perpendicular to the main subrack, such as horizontally above or below a vertical subrack. Since there is no airflow through the front panel or through most backplanes, chassis designers must ensure that they direct sufficient airflow across the major components on the PCB, including the 80321 processor. While the front or rear 40 mm (1.5748 inches) on each CMM does not need high airflow, chassis designers should ensure that the area between these regions is guaranteed a proper airflow as defined in Section 11.4, “Airflow Requirements” on page 57.
Intel NetStructure® MPCMM0002 Chassis Management Module | |
Hardware TPS | July 2007 |
56 | Order Number: 309247-004US |
