Lexmark 5021-0XX Handling the printed circuit boards with MOS ICs, During transportation/storage

Models: 5021-0XX

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5021-0XX

Handling the printed circuit boards with MOS ICs

The following precautions must be observed when handling circuit boards with MOS (Metal Oxide Semiconductor) ICs.

During transportation/storage:

Do not remove new circuit boards from their protective conductive bags until needed.

Do not store or place circuit boards in a location exposed to direct sunlight.

When it becomes necessary to remove a board from its conductive bag or case, always place it on its conductive mat in an area as free as possible from static electricity.

Do not touch pins of the ICs with your bare hands.

During replacement:

Before you unplug connectors from the circuit boards, be sure the power cord has been unplugged from the power outlet.

When you remove a board from its conductive bag or case, do not touch the pins of the ICs or the printed pattern. Place it in position by holding only the edges of the board.

Before you plug connectors into the board, be sure the power cord has been unplugged from the power outlet.

During inspection:

Avoid checking any IC directly with a multimeter; use connectors on the board.

Never create a closed circuit across IC pins with a metal tool.

If it is necessary to touch the ICs and other electrical components on the board, be sure to ground your body.

4-2Service Manual

Page 232
Image 232
Lexmark 5021-0XX manual Handling the printed circuit boards with MOS ICs, During transportation/storage, During replacement