Maxim MAX12527 MAX12527, Dual, 65Msps, 12-Bit, IF/Baseband ADC

MAX12527
Dual, 65Msps, 12-Bit, IF/Baseband ADC
2_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 3.3V, OVDD = 2.0V, GND = 0, REFIN = REFOUT (internal reference), CL≈10pF at digital outputs, VIN = -0.5dBFS (differen-
tial), DIFFCLK/SECLK = OVDD, PD = GND, SHREF = GND, DIV2 = GND, DIV4 = GND, G/T= GND, fCLK = 65MHz, TA= -40°C to
+85°C, unless otherwise noted. Typical values are at TA= +25°C.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDDto GND ................................................................-0.3V to +3.6V
OVDDto GND ............-0.3V to the lower of (VDD+ 0.3V) and +3.6V
INAP, INAN to GND...-0.3V to the lower of (VDD + 0.3V) and +3.6V
INBP, INBN to GND...-0.3V to the lower of (VDD + 0.3V) and +3.6V
CLKP, CLKN to
GND........................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFIN, REFOUT
to GND..................-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFAP, REFAN,
COMA to GND......-0.3V to the lower of (VDD + 0.3V) and +3.6V
REFBP, REFBN,
COMB to GND......-0.3V to the lower of (VDD + 0.3V) and +3.6V
DIFFCLK/SECLK, G/T, PD, SHREF, DIV2,
DIV4 to GND.........-0.3V to the lower of (VDD + 0.3V) and +3.6V
D0A–D11A, D0B–D11B, DAV,
DORA, DORB to GND..............................-0.3V to (OVDD + 0.3V)
Continuous Power Dissipation (TA= +70°C)
68-Pin Thin QFN 10mm x 10mm x 0.8mm
(derate 70mW/°C above +70°C)....................................4000mW
Operating Temperature Range................................-40°C to +85°C
Junction Temperature...........................................................+150°C
Storage Temperature Range.................................-65°C to +150°C
Lead Temperature (soldering 10s).......................................+300°C
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX
UNITS
DC ACCURACY
Resolution 12 Bits
Integral Nonlinearity INL fIN = 3MHz
±0.3 ±1.1
LSB
Differential Nonlinearity DNL fIN = 3MHz, no missing codes
±0.3 ±0.65
LSB
Offset Error
±0.1 ±0.7
%FSR
±0.5 ±5.7
Gain Error (Note 2)
±0.5 ±3.4
%FSR
ANALOG INPUT (INAP, INAN, INBP, INBN)
Differential Input Voltage Range VDIFF Differential or single-ended inputs
±1.024
V
Common-Mode Input Voltage
VDD / 2
V
Analog Input Resistance RIN Each input (Figure 3) 3.4 kΩ
CPAR Fixed capacitance to ground,
each input (Figure 3) 2
Analog Input Capacitance
CSAMPLE
Switched capacitance,
each input (Figure 3) 4.5
pF
CONVERSION RATE
Maximum Clock Frequency fCLK 65 MHz
Minimum Clock Frequency 5MHz
Data Latency Figure 5 8
Clock
Cycles
DYNAMIC CHARACTERISTICS (differential inputs)
Small-Signal Noise Floor SSNF Input at -35dBFS (Note 2)
67.0 71.1
dBFS
fIN = 3MHz at -0.5dBFS
68.2 70.8
fIN = 32.5MHz at -0.5dBFS
70.6
fIN = 70MHz at -0.5dBFS
70.4
Signal-to-Noise Ratio SNR
fIN = 175MHz at -0.5dBFS
67.2 69.8
dB