Thermal Validation
B
Board component temperatures are affected by ambient temperature, air flow, board electrical operation, and software operation. In order to evaluate the thermal performance of a circuit board assembly, it is necessary to test the board under actual operating conditions. These operating conditions vary depending on system design.
While Motorola performs thermal analysis in a representative system to verify operation within specified ranges, refer to Appendix A, Specifications, you should evaluate the thermal performance of the board in your application.
This appendix provides systems integrators with information which can be used to conduct thermal evaluations of the board in their specific system configuration. It identifies thermally significant components and lists the corresponding maximum allowable component operating temperatures. It also provides example procedures for
Thermally Significant Components
The following table summarizes components that exhibit significant temperature rises. These are the components that should be monitored in order to assess thermal performance. The table also supplies the component reference designator and the maximum allowable operating temperature.
You can find components on the board by their reference designators as shown in Figure
The preferred measurement location for a component may be junction, case, or air as specified in the table. Junction temperature refers to the temperature measured by an
MVME6100 Installation and Use (V6100A/IH2) | 69 |
