Intel 41110 manual About This Document, Terminology and Definitions Sheet 1, Term Definition

About This Document 1

This document provides layout information and guidelines for designing platform or add-in board applications with the Intel® 41110 Serial to Parallel PCI Bridge (also called the 41110 Bridge). It is recommended that this document be used as a guideline. Intel recommends employing best-known design practices with board level simulation, signal integrity testing and validation for a robust design.

Designers should note that this guide focuses upon specific design considerations for the 41110 Bridge and is not intended to be an all-inclusive list of all good design practices. Use this guide as a starting point and use empirical data to optimize your particular design.

1.1Terminology and Definitions

Table 1 provides a list of terms and definitions that may be useful when working with the 41110 Bridge product.

Table 1. Terminology and Definitions (Sheet 1 of 2)

Term		Definition
			Stripline in a PCB is composed of the
			conductor inserted in a dielectric with GND
			planes to the top and bottom.
Stripline			NOTE: An easy way to distinguish stripline
			from microstrip is that you need to
			strip away layers of the board to view
			the trace on stripline.
			Microstrip in a PCB is composed of the
Microstrip			conductor on the top layer above the dielectric
			with a ground plane below
	Material used for the lamination process of manufacturing PCBs. It consists of a layer of
Prepreg	epoxy material that is placed between two cores. This layer melts into epoxy when heated and
	forms around adjacent traces.
Core	Material used for the lamination process of manufacturing PCBs. This material is two sided
	laminate with copper on each side. The core is an internal layer that is etched.

Intel® 41110 Serial to Parallel PCI Bridge Design Guide 7