Intel 41110 manual Material, Impedance, Customer Reference Boards, CRB Board Stackup Sheet 2

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41110 Customer Reference Boards

Table 18. CRB Board Stackup (Sheet 2 of 2)

Layer

Type

Thickness

Copper Weight

(mils)

 

 

 

 

 

 

 

1

Signal

2.00

1/2 + plating

 

 

 

 

 

Prepreg

4.50

 

 

 

 

 

2

Plane: GND

1.20

1

 

 

 

 

 

Core

4.80

 

 

 

 

 

3

Signal

1.20

1

 

 

 

 

 

Prepreg

4.50

 

 

 

 

 

8

Signal

2.00

1/2 + plating

 

 

 

 

Est. Total

 

62 +/- 7

 

Thickness

 

 

 

 

 

 

 

 

 

11.2Material

The following materials are used with the 41110 CRB:

FR-4, 0.062 in. +/- .007, 1.0 oz Copper Power/GND.

Full length PCI Raw Card (3.3V Universal) 6.2” high x 7.00” long max with ½ inch cut away.

11.3Impedance

Most signal layers require controlled Impedance of 60 +/- 5% microstrip or stripline where appropriate.

Differential signals for the PCI-E interface require matched 100 differential termination realized as matched 50resistances referenced to ground.

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Intel® 41110 Serial to Parallel PCI Bridge Design Guide

Image 52
Contents Intel 41110 Serial to Parallel PCI Bridge Design GuideIntel 41110 Serial to Parallel PCI Bridge Design Guide Contents Figures TablesContents Revision History Date Revision Description March 001 Initial releaseAbout This Document Terminology and DefinitionsTerminology and Definitions Sheet 1 Term DefinitionAbout This Document Terminology and Definitions Sheet 2PCI-X Interface Features PCI Express Interface FeaturesIntroduction2 Power Management SMBus for configuration register initializationSMBus Interface IntroductionMicrocontroller Block Diagram Microcontroller Connections toJtag Related DocumentsBlock Diagram Intel 41110 Serial to Parallel PCI Bridge ApplicationsAdapter Card Block Diagram Package Specification Package InformationBridge Package Dimensions Side View Package InformationPower Plane Layout 41110 Decoupling GuidelinesPower Plane Layout Split Voltage Planes Decoupling Guidelines41110 300PCI ARST# and PERST# Timing Requirements Reset and Power Timing Considerations5VCC15 and VCC33 Voltage Requirements Reset and Power Timing Considerations General Routing Guidelines General Routing GuidelinesCrosstalk EMI Considerations General Routing GuidelinesTrace Impedance Power Distribution and DecouplingDecoupling Differential Impedance Cross Section of Differential TraceAdapter Card Topology Board Layout GuidelinesAdapter Card Stack Up, Microstrip and Stripline Board Layout Guidelines Adapter Card StackupAINT# Interrupt Pins PCI Express INTx Message PCI-X Layout GuidelinesInterrupts INTx Routing TablePCI Arbitration Interrupt Routing for Devices Behind a BridgePCI-X Layout Guidelines Interrupt Binding for Devices Behind a BridgePCI General Layout Guidelines PCI Resistor CompensationPCI-X Signals PCI Clock Layout GuidelinesPCI Pullup Resistors Not Required PCI/PCI-X Frequency/Mode StrapsPCI Clock Distribution and Matching Requirements PCI-X Clock Layout Requirements Summary Parameter Routing Guidelines41110 Layout Analysis PCI-X Topology Layout GuidelinesPCI-X Slot Guidelines Embedded PCI-X 133 MHz Routing Recommendations Embedded PCI-X 133 MHzParameter Routing Guideline for Lower AD Bus Embedded PCI-X 100 MHz Embedded PCI-X 100 MHz Routing RecommendationsPCI-X 66 MHz Embedded Topology PCI-X 66 MHz Embedded Routing RecommendationsPCI 66 MHz Embedded Topology PCI 66 MHz Embedded TablePCI 33 MHz Embedded Mode Topology PCI 33 MHz Embedded Routing RecommendationsPCI Express Layout General recommendationsPCI-Express Layout Guidelines Adapter Card Layout GuidelinesPCI Express Layout Adapter Card Routing Recommendations Sheet 1Adapter Card Routing Recommendations Sheet 2 This page intentionally left blank Config Circuit Implementations10.1 41110 Analog Voltage Filters Circuit ImplementationsPCI Analog Voltage Filters PCI Express Analog Voltage FilterBandgap Analog Voltage Filter PCI Express Analog Voltage Filter Circuit10.2 41110 Reference and Compensation Pins Bandgap Analog Voltage Filter CircuitSM Bus SMBUs Address ConfigurationBit Value This page intentionally left blank Layer Type Thickness Copper Weight Customer Reference BoardsBoard Stack-up CRB Board Stackup Sheet 1Material ImpedanceCustomer Reference Boards CRB Board Stackup Sheet 2Board Outline Mechanical OutlineThis page intentionally left blank Design Guide Checklist PCI Express Interface SignalsSignals Recommendations Reason/Impact PERCOMP10Design Guide Checklist PCI/PCI-X Interface Signals Sheet 1PCI/PCI-X Interface Signals Sheet 2 Miscellaneous SignalsSMBus Interface Signals Recommendations Reason/ImpactReset Pins Ballout Pin Name UsagePower and Ground Signals Signal Recommendations Reason/ImpactJtag Signals This page intentionally left blank