Cypress CY7C1382F, CY7C1380F TAP Timing, Reserved, Parameter Description Min, Clock, Hold Times

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CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F

when the EXTEST is entered as the current instruction. When HIGH, it enables the output buffers to drive the output bus. When LOW, this bit places the output bus into a High-Z condition.

This bit can be set by entering the SAMPLE/PRELOAD or EXTEST command, and then shifting the desired bit into that cell, during the Shift-DR state. During Update-DR, the value loaded into that shift-register cell latches into the preload register. When the EXTEST instruction is entered, this bit directly controls the

output Q-bus pins. Note that this bit is preset HIGH to enable the output when the device is powered up, and also when the TAP controller is in the Test-Logic-Reset state.

Reserved

These instructions are not implemented but are reserved for future use. Do not use these instructions.

TAP Timing

Test Clock

 

(TCK)

tTH

 

 

tTMSS tTMSH

Test Mode Select (TMS)

tTDIS tTDIH

Test Data-In (TDI)

tTL tCYC

tTDOV

tTDOX

Test Data-Out (TDO)

DON’T CARE

UNDEFINED

TAP AC Switching Characteristics Over the Operating Range [10, 11]

Parameter

Description

Min

Max

Unit

Clock

 

 

 

 

tTCYC

TCK Clock Cycle Time

50

 

ns

tTF

TCK Clock Frequency

 

20

MHz

tTH

TCK Clock HIGH time

20

 

ns

tTL

TCK Clock LOW time

20

 

ns

Output Times

 

 

 

 

tTDOV

TCK Clock LOW to TDO Valid

 

10

ns

tTDOX

TCK Clock LOW to TDO Invalid

0

 

ns

Setup Times

 

 

 

 

tTMSS

TMS Setup to TCK Clock Rise

5

 

ns

tTDIS

TDI Setup to TCK Clock Rise

5

 

ns

tCS

Capture Setup to TCK Rise

5

 

ns

Hold Times

 

 

 

 

tTMSH

TMS Hold after TCK Clock Rise

5

 

ns

tTDIH

TDI Hold after Clock Rise

5

 

ns

tCH

Capture Hold after Clock Rise

5

 

ns

Notes

10.tCS and tCH refer to the setup and hold time requirements of latching data from the boundary scan register.

11.Test conditions are specified using the load in TAP AC test conditions. tR/tF = 1ns.

Document #: 38-05543 Rev. *F

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Contents Selection Guide FeaturesFunctional Description Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1380D/CY7C1380F 3 512K x Logic Block Diagram CY7C1382D/CY7C1382F 3 1M xPin Configurations Pin Tqfp Pinout 3-Chip EnableBall BGA Pinout Ball Fbga Pinout 3-Chip Enable Pin Definitions Name Description Power supply inputs to the core of the devicePower supply for the I/O circuitry Ground for the core of the deviceTCK Jtag Pin DefinitionsTMS Single Write Accesses Initiated by Adsc Single Write Accesses Initiated by AdspSingle Read Accesses Functional OverviewAddress Sleep ModeBurst Sequences A1 A0 Parameter Description Test Conditions MinTruth Table Operation Add. Used Function CY7C1382D/CY7C1382F Truth Table for Read/Write 4 Function CY7C1380D/CY7C1380F Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller State DiagramTAP Controller Block Diagram TAP Instruction Set Bypass RegisterParameter Description Min TAP TimingReserved Clock5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Parameter Description Test Conditions MinIdentification Codes Identification Register DefinitionsScan Register Sizes Register Name Bit SizeBall BGA Boundary Scan Order 14 Bit # Ball IDA10 B10 P10 Operating Range Electrical Characteristics Over the Operating RangeMaximum Ratings Range AmbientPackage CapacitanceThermal Resistance EIA/JESD51AC Test Loads and Waveforms 3V I/O Test Load 5V I/O Test LoadOutput Times Switching Characteristics Over the Operating Range 20Setup Times Switching Waveforms Read Cycle TimingWrite Cycle Timing 26 Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information 200 167 Package Diagrams Pin Thin Plastic Quad Flat Pack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Submission Orig. Description of Change DateUSB Sales, Solutions, and Legal InformationWorldwide Sales and Design Support Products PSoC Solutions