Cypress CY7C1380D, CY7C1380F, CY7C1382F manual Features, Functional Description, Selection Guide

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CY7C1380D, CY7C1382D

CY7C1380F, CY7C1382F

18-Mbit (512K x 36/1M x 18) Pipelined SRAM

Features

Supports bus operation up to 250 MHz

Available speed grades are 250, 200, and 167 MHz

Registered inputs and outputs for pipelined operation

3.3V core power supply

2.5V or 3.3V I/O power supply

Fast clock-to-output times

2.6 ns (for 250 MHz device)

Provides high performance 3-1-1-1 access rate

User selectable burst counter supporting Intel Pentium® inter- leaved or linear burst sequences

Separate processor and controller address strobes

Synchronous self-timed write

Asynchronous output enable

Single cycle chip deselect

CY7C1380D/CY7C1382D is available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball FBGA package; CY7C1380F/CY7C1382F is available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non Pb-free 119-ball BGA and 165-ball FBGA package

IEEE 1149.1 JTAG-Compatible Boundary Scan

ZZ sleep mode option

Functional Description

The CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F[1] SRAM integrates 524,288 x 36 and 1,048,576 x 18 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive edge triggered clock input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining chip enable (CE1), depth-expansion chip enables (CE2 and CE3 [2]), burst control

inputs (ADSC, ADSP, and ADV), write enables (BWX, and BWE), and global write (GW). Asynchronous inputs include the output enable (OE) and the ZZ pin.

Addresses and chip enables are registered at rising edge of clock when address strobe processor (ADSP) or address strobe controller (ADSC) are active. Subsequent burst addresses can be internally generated as they are controlled by the advance pin (ADV).

Address, data inputs, and write controls are registered on-chip to initiate a self-timed write cycle.This part supports byte write operations (see Table 1 on page 6 and “Truth Table” on page 10 for further details). Write cycles can be one to two or four bytes wide as controlled by the byte write control inputs. GW when active LOW causes all bytes to be written.

The CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F operates from a +3.3V core power supply while all outputs operate with a +2.5 or +3.3V power supply. All inputs and outputs are JEDEC-standard and JESD8-5-compatible.

Selection Guide

Description

250 MHz

200 MHz

167 MHz

Unit

Maximum Access Time

2.6

3.0

3.4

ns

 

 

 

 

 

Maximum Operating Current

350

300

275

mA

 

 

 

 

 

Maximum CMOS Standby Current

70

70

70

mA

 

 

 

 

 

Notes

1.For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.

2.CE3, CE2 are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document #: 38-05543 Rev. *F

 

Revised January 12, 2009

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Contents Functional Description FeaturesSelection Guide Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1382D/CY7C1382F 3 1M x Logic Block Diagram CY7C1380D/CY7C1380F 3 512K xPin Tqfp Pinout 3-Chip Enable Pin ConfigurationsBall BGA Pinout Ball Fbga Pinout 3-Chip Enable Power supply for the I/O circuitry Power supply inputs to the core of the devicePin Definitions Name Description Ground for the core of the deviceTMS Pin DefinitionsTCK Jtag Single Read Accesses Single Write Accesses Initiated by AdspSingle Write Accesses Initiated by Adsc Functional OverviewBurst Sequences Sleep ModeAddress A1 A0 Parameter Description Test Conditions MinOperation Add. Used Truth TableFunction CY7C1380D/CY7C1380F Truth Table for Read/Write 4Function CY7C1382D/CY7C1382F TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetReserved TAP TimingParameter Description Min Clock3V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions5V TAP AC Test Conditions Parameter Description Test Conditions MinScan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeBit # Ball ID Ball BGA Boundary Scan Order 14A10 B10 P10 Maximum Ratings Electrical Characteristics Over the Operating RangeOperating Range Range AmbientThermal Resistance CapacitancePackage EIA/JESD515V I/O Test Load AC Test Loads and Waveforms 3V I/O Test LoadSetup Times Switching Characteristics Over the Operating Range 20Output Times Read Cycle Timing Switching WaveformsWrite Cycle Timing 26 Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information 200 167 Pin Thin Plastic Quad Flat Pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Submission Orig. Description of Change Date Document HistoryWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal InformationUSB