Cypress CY7C1382F, CY7C1380F Switching Characteristics Over the Operating Range 20, Output Times

Page 22

CY7C1380D, CY7C1382D

CY7C1380F, CY7C1382F

Switching Characteristics Over the Operating Range [20, 21]

 

Description

250 MHz

200 MHz

167 MHz

Unit

Parameter

Min

Max

Min

Max

Min

Max

 

 

t

V (Typical) to the first Access [22]

1

 

1

 

1

 

ms

POWER

DD

 

 

 

 

 

 

 

Clock

tCYC

Clock Cycle Time

4.0

 

5

 

6

tCH

Clock HIGH

1.7

 

2.0

 

2.2

tCL

Clock LOW

1.7

 

2.0

 

2.2

Output Times

 

 

 

 

 

 

ns

ns

ns

tCO

tDOH

tCLZ

tCHZ

tOEV

tOELZ

tOEHZ

Data Output Valid After CLK Rise

 

2.6

 

3.0

 

3.4

ns

Data Output Hold After CLK Rise

1.0

 

1.3

 

1.3

 

ns

Clock to Low-Z [23, 24, 25]

1.0

 

1.3

 

1.3

 

ns

Clock to High-Z [23, 24, 25]

 

2.6

 

3.0

 

3.4

ns

 

LOW to Output Valid

 

2.6

 

3.0

 

3.4

ns

OE

 

 

LOW to Output Low-Z [23, 24, 25]

0

 

0

 

0

 

ns

OE

 

 

HIGH to Output High-Z [23, 24, 25]

 

2.6

 

3.0

 

3.4

ns

OE

 

Setup Times

tAS

 

Address Setup Before CLK Rise

1.2

 

1.4

 

1.5

tADS

 

ADSC,

 

ADSP

Setup Before CLK Rise

1.2

 

1.4

 

1.5

tADVS

 

 

 

 

Setup Before CLK Rise

1.2

 

1.4

 

1.5

ADV

tWES

 

GW,

 

BWE,

 

BW

X Setup Before CLK Rise

1.2

 

1.4

 

1.5

tDS

 

Data Input Setup Before CLK Rise

1.2

 

1.4

 

1.5

tCES

 

Chip Enable SetUp Before CLK Rise

1.2

 

1.4

 

1.5

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ns

ns

ns

ns

ns

ns

tAH

tADH

tADVH

tWEH

tDH

tCEH

Address Hold After CLK Rise

0.3

 

0.4

 

0.5

ADSP,

 

ADSC

Hold After CLK Rise

0.3

 

0.4

 

0.5

ADV

 

Hold After CLK Rise

0.3

 

0.4

 

0.5

 

 

 

 

 

X Hold After CLK Rise

0.3

 

0.4

 

0.5

GW,

BWE,

BW

Data Input Hold After CLK Rise

0.3

 

0.4

 

0.5

Chip Enable Hold After CLK Rise

0.3

 

0.4

 

0.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ns

ns

ns

ns

ns

ns

Notes

20.Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.

21.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

22.This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a read or write operation can be initiated.

23.tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of “AC Test Loads and Waveforms” on page 21. Transition is measured ± 200 mV from steady-state voltage.

24.At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions.

25.This parameter is sampled and not 100% tested.

Document #: 38-05543 Rev. *F

Page 22 of 34

[+] Feedback

Image 22
Contents Selection Guide FeaturesFunctional Description Description 250 MHz 200 MHz 167 MHz UnitLogic Block Diagram CY7C1380D/CY7C1380F 3 512K x Logic Block Diagram CY7C1382D/CY7C1382F 3 1M xPin Configurations Pin Tqfp Pinout 3-Chip EnableBall BGA Pinout Ball Fbga Pinout 3-Chip Enable Pin Definitions Name Description Power supply inputs to the core of the devicePower supply for the I/O circuitry Ground for the core of the deviceTMS Pin DefinitionsTCK Jtag Single Write Accesses Initiated by Adsc Single Write Accesses Initiated by AdspSingle Read Accesses Functional OverviewAddress Sleep ModeBurst Sequences A1 A0 Parameter Description Test Conditions MinTruth Table Operation Add. UsedFunction CY7C1380D/CY7C1380F Truth Table for Read/Write 4Function CY7C1382D/CY7C1382F TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag TAP Instruction Set Bypass RegisterParameter Description Min TAP TimingReserved Clock5V TAP AC Test Conditions TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions Parameter Description Test Conditions MinIdentification Codes Identification Register DefinitionsScan Register Sizes Register Name Bit SizeBall BGA Boundary Scan Order 14 Bit # Ball IDA10 B10 P10 Operating Range Electrical Characteristics Over the Operating RangeMaximum Ratings Range AmbientPackage CapacitanceThermal Resistance EIA/JESD51AC Test Loads and Waveforms 3V I/O Test Load 5V I/O Test LoadSetup Times Switching Characteristics Over the Operating Range 20Output Times Switching Waveforms Read Cycle TimingWrite Cycle Timing 26 Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information 200 167 Package Diagrams Pin Thin Plastic Quad Flat Pack 14 x 20 x 1.4 mmBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Submission Orig. Description of Change DateWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal InformationUSB