Cypress CY7C1382D, CY7C1380F Maximum Ratings, Electrical Characteristics Over the Operating Range

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CY7C1380D, CY7C1382D CY7C1380F, CY7C1382F

Maximum Ratings

Exceeding the maximum ratings may impair the useful life of the device. For user guidelines, not tested.

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.3V to +4.6V

Supply Voltage on VDDQ Relative to GND

–0.3V to +VDD

DC Voltage Applied to Outputs

 

 

in Tri-State

–0.5V to VDDQ + 0.5V

Electrical Characteristics Over the Operating Range

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

20 mA

Static Discharge Voltage

>2001V

(per MIL-STD-883, Method 3015)

 

Latch-up Current

>200 mA

Operating Range

 

Range

Ambient

VDD

VDDQ

 

Temperature

 

Commercial

0°C to +70°C

3.3V –5%/+10%

2.5V – 5%

 

 

 

 

to VDD

 

Industrial

–40°C to +85°C

 

[17, 18]

 

 

 

Parameter

Description

Test Conditions

Min

Max

Unit

VDD

Power Supply Voltage

 

 

3.135

3.6

V

VDDQ

I/O Supply Voltage

for 3.3V I/O

 

3.135

VDD

V

 

 

 

for 2.5V I/O

 

2.375

2.625

V

VOH

Output HIGH Voltage

for 3.3V I/O, IOH = –4.0 mA

 

2.4

 

V

 

 

 

for 2.5V I/O, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 3.3V I/O, IOL = 8.0 mA

 

 

0.4

V

 

 

 

for 2.5V I/O, IOL = 1.0 mA

 

 

0.4

V

V

IH

Input HIGH Voltage [17]

for 3.3V I/O

 

2.0

V + 0.3V

V

 

 

 

 

 

DD

 

 

 

 

for 2.5V I/O

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage [17]

for 3.3V I/O

 

–0.3

0.8

V

 

 

 

for 2.5V I/O

 

–0.3

0.7

V

IX

Input Leakage Current

GND ≤ VI ≤ VDDQ

 

–5

5

μA

 

 

except ZZ and MODE

 

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

μA

 

 

 

Input = VDD

 

 

5

μA

 

 

Input Current of ZZ

Input = VSS

 

–5

 

μA

 

 

 

Input = VDD

 

 

30

μA

IOZ

Output Leakage Current

GND ≤ VI ≤ VDDQ, Output Disabled

 

–5

5

μA

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

4.0-ns cycle, 250 MHz

 

350

mA

 

 

Current

f = fMAX = 1/tCYC

5.0-ns cycle, 200 MHz

 

300

mA

 

 

 

 

6.0-ns cycle, 167 MHz

 

275

mA

ISB1

Automatic CE

VDD = Max, Device Deselected,

4.0-ns cycle, 250 MHz

 

160

mA

 

 

Power Down

VIN ≥ VIH or VIN ≤ VIL

5.0-ns cycle, 200 MHz

 

150

mA

 

 

Current—TTL Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

 

6.0-ns cycle, 167 MHz

 

140

mA

ISB2

Automatic CE Power

VDD = Max, Device Deselected,

All speeds

 

70

mA

 

 

Down Current-CMOS

VIN ≤ 0.3V or VIN > VDDQ – 0.3V, f = 0

 

 

 

 

 

 

Inputs

 

 

 

 

 

ISB3

Automatic CE

VDD = Max, Device Deselected, or

4.0-ns cycle, 250 MHz

 

135

mA

 

 

Power Down

VIN ≤ 0.3V or VIN > VDDQ – 0.3V

5.0-ns cycle, 200 MHz

 

130

mA

 

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

 

6.0-ns cycle, 167 MHz

 

125

mA

ISB4

Automatic CE

VDD = Max, Device Deselected,

All speeds

 

80

mA

 

 

Power Down

VIN ≥ VIH or VIN ≤ VIL, f = 0

 

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

Notes

17.Overshoot: VIH(AC) < VDD +1.5V (pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (pulse width less than tCYC/2).

18.TPower up: Assumes a linear ramp from 0v to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document #: 38-05543 Rev. *F

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Contents Description 250 MHz 200 MHz 167 MHz Unit FeaturesFunctional Description Selection GuideLogic Block Diagram CY7C1382D/CY7C1382F 3 1M x Logic Block Diagram CY7C1380D/CY7C1380F 3 512K xPin Tqfp Pinout 3-Chip Enable Pin ConfigurationsBall BGA Pinout Ball Fbga Pinout 3-Chip Enable Ground for the core of the device Power supply inputs to the core of the devicePower supply for the I/O circuitry Pin Definitions Name DescriptionTMS Pin DefinitionsTCK Jtag Functional Overview Single Write Accesses Initiated by AdspSingle Read Accesses Single Write Accesses Initiated by AdscA1 A0 Parameter Description Test Conditions Min Sleep ModeBurst Sequences AddressOperation Add. Used Truth TableFunction CY7C1380D/CY7C1380F Truth Table for Read/Write 4Function CY7C1382D/CY7C1382F TAP Controller Block Diagram TAP Controller State DiagramIeee 1149.1 Serial Boundary Scan Jtag Bypass Register TAP Instruction SetClock TAP TimingReserved Parameter Description MinParameter Description Test Conditions Min TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions 5V TAP AC Test Conditions Register Name Bit Size Identification Register Definitions Scan Register Sizes Identification CodesBit # Ball ID Ball BGA Boundary Scan Order 14A10 B10 P10 Range Ambient Electrical Characteristics Over the Operating RangeMaximum Ratings Operating RangeEIA/JESD51 CapacitanceThermal Resistance Package5V I/O Test Load AC Test Loads and Waveforms 3V I/O Test LoadSetup Times Switching Characteristics Over the Operating Range 20Output Times Read Cycle Timing Switching WaveformsWrite Cycle Timing 26 Read/Write Cycle Timing 26, 28 ZZ Mode Timing 30 Ordering Information 200 167 Pin Thin Plastic Quad Flat Pack 14 x 20 x 1.4 mm Package DiagramsBall BGA 14 x 22 x 2.4 mm Soldernotespad Type NON-SOLDER Mask Defined Nsmd Submission Orig. Description of Change Date Document HistoryWorldwide Sales and Design Support Products PSoC Solutions Sales, Solutions, and Legal InformationUSB