Cypress CY7C1360C manual Features, Functional Description1, Logic Block Diagram CY7C1362C 512K x

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CY7C1360C

CY7C1362C

9-Mbit (256K x 36/512K x 18) Pipelined SRAM

Features

Supports bus operation up to 250 MHz

Available speed grades are 250, 200, and 166 MHz

Registered inputs and outputs for pipelined operation

3.3V core power supply (VDD)

2.5V/3.3V I/O operation (VDDQ)

Fast clock-to-output times

— 2.8 ns (for 250-MHz device)

Provide high-performance 3-1-1-1 access rate

User-selectable burst counter supporting Intel

Pentium® interleaved or linear burst sequences

Separate processor and controller address strobes

Synchronous self-timed writes

Asynchronous output enable

Single Cycle Chip Deselect

Available in lead-free 100-Pin TQFP package, lead-free and non lead-free 119-Ball BGA package and 165-Ball FBGA package

TQFP Available with 3-Chip Enable and 2-Chip Enable

IEEE 1149.1 JTAG-Compatible Boundary Scan

Functional Description[1]

The CY7C1360C/CY7C1362C SRAM integrates 256K x 36 and 512K x 18 SRAM cells with advanced synchronous peripheral circuitry and a two-bit counter for internal burst operation. All synchronous inputs are gated by registers controlled by a positive-edge-triggered Clock Input (CLK). The synchronous inputs include all addresses, all data inputs, address-pipelining Chip Enable (CE1), depth-expansion Chip Enables (CE2 and CE3[2]), Burst Control inputs (ADSC, ADSP, and ADV), Write Enables (BWX, and BWE), and Global Write (GW). Asynchronous inputs include the Output Enable (OE) and the ZZ pin.

Addresses and chip enables are registered at rising edge of clock when either Address Strobe Processor (ADSP) or Address Strobe Controller (ADSC) are active. Subsequent burst addresses can be internally generated as controlled by the Advance pin (ADV).

Address, data inputs, and write controls are registered on-chip to initiate a self-timed Write cycle.This part supports Byte Write operations (see Pin Descriptions and Truth Table for further details). Write cycles can be one to two or four bytes wide as controlled by the Byte Write control inputs. GW when active LOW causes all bytes to be written.

The CY7C1360C/CY7C1362C operates from a +3.3V core power supply while all outputs may operate with either a +2.5 or +3.3V supply. All inputs and outputs are JEDEC-standard JESD8-5-compatible.

Logic Block Diagram – CY7C1362C (512K x 18)

 

 

 

 

A0, A1, A

ADDRESS

 

 

 

 

 

 

REGISTER

 

 

 

 

 

 

 

 

 

 

 

 

 

MODE

 

2

A[1:0]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV

 

BURST

Q1

 

 

 

 

CLK

COUNTER AND

 

 

 

 

 

 

LOGIC

 

 

 

 

 

 

CLR

 

Q0

 

 

 

 

ADSC

 

 

 

 

 

 

 

ADSP

 

 

 

 

 

 

 

 

DQB,DQPB

 

DQB,DQPB

 

 

 

 

 

 

WRITE DRIVER

 

 

 

 

BWB

WRITE REGISTER

 

 

 

OUTPUT

DQs

 

 

 

OUTPUT

 

 

MEMORY

SENSE

 

 

 

BUFFERS

DQPA

 

 

 

AMPS

REGISTERS

 

 

 

ARRAY

E

DQPB

 

DQA,DQPA

 

DQA,DQPA

 

 

 

 

 

 

 

BWA

 

WRITE DRIVER

 

 

 

 

WRITE REGISTER

 

 

 

 

 

 

 

 

 

 

 

BWE

 

 

 

 

 

 

INPUT

GW

 

 

 

 

 

 

ENABLE

 

 

 

 

 

REGISTERS

CE1

PIPELINED

 

 

 

REGISTER

 

 

 

 

CE2

 

ENABLE

 

 

 

 

CE3

 

 

 

 

 

 

 

 

 

 

 

 

OE

 

 

 

 

 

 

 

ZZ

SLEEP

 

 

 

 

 

 

CONTROL

 

 

 

 

 

 

 

 

 

 

 

 

 

Notes:

1.For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.

2.CE3 is for A version of TQFP (3 Chip Enable option) and 165 FBGA package only. 119 BGA is offered only in 2 Chip Enable.

Cypress Semiconductor Corporation

198 Champion Court • San Jose, CA 95134-1709

408-943-2600

Document #: 38-05540 Rev. *H

 

Revised September 14, 2006

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Contents Logic Block Diagram CY7C1362C 512K x FeaturesFunctional Description1 Cypress Semiconductor CorporationSelection Guide Maximum Access Time Maximum Operating Current250 MHz 200 MHz 166 MHz Unit Maximum Cmos Standby Current Document # 38-05540 Rev. *HCY7C1360C 256K X Pin Configurations Pin Tqfp Pinout 3 Chip Enables a VersionCY7C1362C 512K x CY7C1362C Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ VersionNC/576M Pin Configurations Ball BGA Pinout 2 Chip Enables with JtagNC/72M NC/36M NC/288MNC/18M Pin Configurations Ball Fbga Pinout 3 Chip Enable with JtagNC/72M Pin Definitions Single Write Accesses Initiated by Adsp Single Read AccessesSingle Write Accesses Initiated by Adsc Functional OverviewLinear Burst Address Table Mode = GND Interleaved Burst Address Table Mode = Floating or VDDZZ Mode Electrical Characteristics Read Cycle, Continue Burst Next Partial Truth Table for Read/Write5Write Cycle, Continue Burst Next Read Cycle, Suspend Burst Write Cycle, Suspend BurstTest Access Port TAP Disabling the Jtag FeatureTruth Table for Read/Write5 Ieee 1149.1 Serial Boundary Scan JtagPerforming a TAP Reset TAP Controller Block DiagramTAP Registers TAP Instruction SetIdcode TAP TimingTAP DC Electrical Characteristics And Operating Conditions TAP AC Switching Characteristics Over the Operating Range103V TAP AC Test Conditions 5V TAP AC Test ConditionsScan Register Sizes Identification Register DefinitionsIdentification Codes CY7C1362C 512K x Bit# Ball ID Signal CY7C1360C 256K x Bit# Ball ID SignalBall Fbga Boundary Scan Order NameBall BGA Boundary Scan Order CY7C1362C 512K x Bit# Ball ID Signal NameMaximum Ratings Electrical Characteristics Over the Operating Range14Operating Range Ambient RangeThermal Resistance Capacitance16AC Test Loads and Waveforms 3V I/O Test Load250 200 166 Parameter Description Unit Min Switching Characteristics Over the Operating Range 17Min Max Set-up TimesRead Cycle Timing23 Switching WaveformsBWE BWX ADV Write Cycle Timing23CLZ Read/Write Cycle Timing23, 25DON’T Care ZZ Mode Timing27Ordering Information CY7C1360C CY7C1362C CY7C1360C CY7C1362C Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball Pbga 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change