Cypress CY7C1360C Identification Register Definitions, Scan Register Sizes, Identification Codes

Page 15

CY7C1360C

CY7C1362C

TAP DC Electrical Characteristics And Operating Conditions

(0°C < T < +70°C; V

DD

= 3.3V ±0.165V unless otherwise noted)[12] (continued)

 

 

 

 

 

A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Parameter

 

 

 

Description

 

 

 

Conditions

 

 

Min.

 

Max.

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VOL2

 

Output LOW Voltage

 

IOL = 100 µA

 

VDDQ = 3.3V

 

 

0.2

 

V

 

 

 

 

 

 

 

 

 

 

VDDQ = 2.5V

 

 

0.2

 

V

VIH

 

Input HIGH Voltage

 

 

 

 

VDDQ = 3.3V

2.0

 

VDD + 0.3

 

V

 

 

 

 

 

 

 

 

 

 

VDDQ = 2.5V

1.7

 

VDD + 0.3

 

V

VIL

 

Input LOW Voltage

 

 

 

 

VDDQ = 3.3V

–0.5

 

0.7

 

V

 

 

 

 

 

 

 

 

 

 

VDDQ = 2.5V

–0.3

 

0.7

 

V

IX

 

Input Load Current

 

GND < VIN < VDDQ

 

 

 

–5

 

5

 

µA

Identification Register Definitions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Field

 

CY7C1360C

CY7C1362C

 

 

Description

 

 

(256KX36)

(512KX18)

 

 

 

Revision Number (31:29)

 

000

 

000

Describes the version number

 

 

 

 

 

 

 

 

 

 

 

Device Depth (28:24)[13]

 

01011

01011

Reserved for Internal Use

 

 

 

Device Width (23:18) 119-BGA

 

101000

101000

Defines memory type and architecture

 

 

 

 

 

 

 

 

 

Device Width (23:18) 165- FBGA

 

000000

000000

Defines memory type and architecture

 

 

 

 

 

 

 

 

 

 

 

Cypress Device ID (17:12)

 

100110

010110

Defines width and density

 

 

 

 

 

 

 

 

 

 

Cypress JEDEC ID Code (11:1)

 

00000110100

00000110100

Allows unique identification of SRAM vendor

 

 

 

 

 

 

 

 

ID Register Presence Indicator (0)

 

1

 

1

Indicates the presence of an ID register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Scan Register Sizes

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Register Name

 

 

 

Bit Size (x36)

 

 

Bit Size (x18)

 

Instruction

 

 

 

 

 

 

 

 

3

 

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass

 

 

 

 

 

 

 

 

1

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ID

 

 

 

 

 

 

 

 

32

 

 

 

 

32

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Order (119-ball BGA package)

 

71

 

 

 

 

71

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Order (165-ball FBGA package)

 

71

 

 

 

 

71

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Codes

Instruction

Code

Description

EXTEST

000

Captures I/O ring contents. Places the boundary scan register between TDI and TDO.

 

 

Forces all SRAM outputs to High-Z state.

IDCODE

001

Loads the ID register with the vendor ID code and places the register between TDI and

 

 

TDO. This operation does not affect SRAM operations.

SAMPLE Z

010

Captures I/O ring contents. Places the boundary scan register between TDI and TDO.

 

 

Forces all SRAM output drivers to a High-Z state.

RESERVED

011

Do Not Use: This instruction is reserved for future use.

 

 

 

SAMPLE/PRELOAD

100

Captures I/O ring contents. Places the boundary scan register between TDI and TDO.

 

 

Does not affect SRAM operation.

RESERVED

101

Do Not Use: This instruction is reserved for future use.

 

 

 

RESERVED

110

Do Not Use: This instruction is reserved for future use.

 

 

 

BYPASS

111

Places the bypass register between TDI and TDO. This operation does not affect SRAM

 

 

operations.

Note:

 

 

13. Bit #24 is “1” in the Register Definitions for both 2.5V and 3.3V versions of this device.

Document #: 38-05540 Rev. *H

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram CY7C1362C 512K x Functional Description1Maximum Cmos Standby Current Document # 38-05540 Rev. *H Maximum Access Time Maximum Operating CurrentSelection Guide 250 MHz 200 MHz 166 MHz UnitPin Configurations Pin Tqfp Pinout 3 Chip Enables a Version CY7C1360C 256K XCY7C1362C 512K x CY7C1362C Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ VersionNC/288M Pin Configurations Ball BGA Pinout 2 Chip Enables with JtagNC/576M NC/72M NC/36MPin Configurations Ball Fbga Pinout 3 Chip Enable with Jtag NC/18MNC/72M Pin Definitions Functional Overview Single Read AccessesSingle Write Accesses Initiated by Adsp Single Write Accesses Initiated by AdscInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Write Cycle, Suspend Burst Partial Truth Table for Read/Write5Read Cycle, Continue Burst Next Write Cycle, Continue Burst Next Read Cycle, Suspend BurstIeee 1149.1 Serial Boundary Scan Jtag Disabling the Jtag FeatureTest Access Port TAP Truth Table for Read/Write5TAP Instruction Set TAP Controller Block DiagramPerforming a TAP Reset TAP RegistersIdcode TAP Timing5V TAP AC Test Conditions TAP AC Switching Characteristics Over the Operating Range10TAP DC Electrical Characteristics And Operating Conditions 3V TAP AC Test ConditionsIdentification Register Definitions Scan Register SizesIdentification Codes Name CY7C1360C 256K x Bit# Ball ID SignalCY7C1362C 512K x Bit# Ball ID Signal Ball Fbga Boundary Scan OrderBall BGA Boundary Scan Order CY7C1362C 512K x Bit# Ball ID Signal NameAmbient Range Electrical Characteristics Over the Operating Range14Maximum Ratings Operating Range3V I/O Test Load Capacitance16Thermal Resistance AC Test Loads and WaveformsSet-up Times Switching Characteristics Over the Operating Range 17250 200 166 Parameter Description Unit Min Min MaxRead Cycle Timing23 Switching WaveformsBWE BWX ADV Write Cycle Timing23CLZ Read/Write Cycle Timing23, 25DON’T Care ZZ Mode Timing27Ordering Information CY7C1360C CY7C1362C CY7C1360C CY7C1362C Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package Diagrams90±0.05 Ball Pbga 14 x 22 x 2.4 mmSoldernotespad Type NON-SOLDER Mask Defined Nsmd Document History Issue Date Orig. Description of Change