Cypress CY7C1362C, CY7C1360C TAP Controller Block Diagram, Performing a TAP Reset, TAP Registers

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CY7C1360C

CY7C1362C

TAP Controller Block Diagram

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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2

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TDI

 

 

 

 

 

 

Instruction Register

 

 

 

 

 

Selection

 

 

 

Circuitry

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Circuitry

 

 

 

 

 

 

 

 

 

 

 

31

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Identification Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

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Boundary Scan Register

 

 

 

 

 

 

TCK

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TMS

 

 

 

 

 

 

 

 

 

 

TAP CONTROLLER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

The boundary scan register is connected to all the input and bidirectional balls on the SRAM.

The boundary scan register is loaded with the contents of the RAM I/O ring when the TAP controller is in the Capture-DR state and is then placed between the TDI and TDO balls when

TDO the controller is moved to the Shift-DR state. The EXTEST, SAMPLE/PRELOAD and SAMPLE Z instructions can be used to capture the contents of the I/O ring.

The Boundary Scan Order tables show the order in which the bits are connected. Each bit corresponds to one of the bumps on the SRAM package. The MSB of the register is connected to TDI and the LSB is connected to TDO.

Identification (ID) Register

The ID register is loaded with a vendor-specific, 32-bit code during the Capture-DR state when the IDCODE command is loaded in the instruction register. The IDCODE is hardwired into the SRAM and can be shifted out when the TAP controller is in the Shift-DR state. The ID register has a vendor code and other information described in the Identification Register Definitions table.

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO balls and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK.

Instruction Register

Three-bit instructions can be serially loaded into the instruction register. This register is loaded when it is placed between the TDI and TDO balls as shown in the Tap Controller Block Diagram. Upon power-up, the instruction register is loaded with the IDCODE instruction. It is also loaded with the IDCODE instruction if the controller is placed in a reset state as described in the previous section.

When the TAP controller is in the Capture-IR state, the two least significant bits are loaded with a binary “01” pattern to allow for fault isolation of the board-level serial test data path.

Bypass Register

To save time when serially shifting data through registers, it is sometimes advantageous to skip certain chips. The bypass register is a single-bit register that can be placed between the TDI and TDO balls. This allows data to be shifted through the SRAM with minimal delay. The bypass register is set LOW (VSS) when the BYPASS instruction is executed.

TAP Instruction Set

Overview

Eight different instructions are possible with the three-bit instruction register. All combinations are listed in the Instruction Codes table. Three of these instructions are listed as RESERVED and should not be used. The other five instruc- tions are described in detail below.

The TAP controller used in this SRAM is not fully compliant to the 1149.1 convention because some of the mandatory 1149.1 instructions are not fully implemented.

The TAP controller cannot be used to load address data or control signals into the SRAM and cannot preload the I/O buffers. The SRAM does not implement the 1149.1 commands EXTEST or INTEST or the PRELOAD portion of SAMPLE/PRELOAD; rather, it performs a capture of the I/O ring when these instructions are executed.

Instructions are loaded into the TAP controller during the Shift-IR state when the instruction register is placed between TDI and TDO. During this state, instructions are shifted through the instruction register through the TDI and TDO balls. To execute the instruction once it is shifted in, the TAP controller needs to be moved into the Update-IR state.

EXTEST

EXTEST is a mandatory 1149.1 instruction which is to be executed whenever the instruction register is loaded with all 0s. EXTEST is not implemented in this SRAM TAP controller, and therefore this device is not compliant to 1149.1. The TAP controller does recognize an all-0 instruction.

When an EXTEST instruction is loaded into the instruction register, the SRAM responds as if a SAMPLE/PRELOAD instruction has been loaded. There is one difference between the two instructions. Unlike the SAMPLE/PRELOAD instruction, EXTEST places the SRAM outputs in a High-Z state.

Document #: 38-05540 Rev. *H

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Contents Features Logic Block Diagram CY7C1362C 512K xFunctional Description1 Cypress Semiconductor CorporationMaximum Access Time Maximum Operating Current Selection Guide250 MHz 200 MHz 166 MHz Unit Maximum Cmos Standby Current Document # 38-05540 Rev. *HPin Configurations Pin Tqfp Pinout 3 Chip Enables a Version CY7C1360C 256K XCY7C1362C 512K x Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ Version CY7C1362CPin Configurations Ball BGA Pinout 2 Chip Enables with Jtag NC/576MNC/72M NC/36M NC/288MPin Configurations Ball Fbga Pinout 3 Chip Enable with Jtag NC/18MNC/72M Pin Definitions Single Read Accesses Single Write Accesses Initiated by AdspSingle Write Accesses Initiated by Adsc Functional OverviewInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Partial Truth Table for Read/Write5 Read Cycle, Continue Burst NextWrite Cycle, Continue Burst Next Read Cycle, Suspend Burst Write Cycle, Suspend BurstDisabling the Jtag Feature Test Access Port TAPTruth Table for Read/Write5 Ieee 1149.1 Serial Boundary Scan JtagTAP Controller Block Diagram Performing a TAP ResetTAP Registers TAP Instruction SetTAP Timing IdcodeTAP AC Switching Characteristics Over the Operating Range10 TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions 5V TAP AC Test ConditionsIdentification Register Definitions Scan Register SizesIdentification Codes CY7C1360C 256K x Bit# Ball ID Signal CY7C1362C 512K x Bit# Ball ID SignalBall Fbga Boundary Scan Order NameCY7C1362C 512K x Bit# Ball ID Signal Name Ball BGA Boundary Scan OrderElectrical Characteristics Over the Operating Range14 Maximum RatingsOperating Range Ambient RangeCapacitance16 Thermal ResistanceAC Test Loads and Waveforms 3V I/O Test LoadSwitching Characteristics Over the Operating Range 17 250 200 166 Parameter Description Unit MinMin Max Set-up TimesSwitching Waveforms Read Cycle Timing23Write Cycle Timing23 BWE BWX ADVRead/Write Cycle Timing23, 25 CLZZZ Mode Timing27 DON’T CareOrdering Information CY7C1360C CY7C1362C CY7C1360C CY7C1362C Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Pbga 14 x 22 x 2.4 mm 90±0.05Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History