Cypress CY7C1362C, CY7C1360C manual Maximum Ratings, Operating Range, Ambient Range

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CY7C1360C

CY7C1362C

Maximum Ratings

(Above which the useful life may be impaired. For user guide- lines, not tested.)

Storage Temperature

–65°C to +150°C

Ambient Temperature with

 

 

Power Applied

–55°C to +125°C

Supply Voltage on VDD Relative to GND

–0.5V to +4.6V

Supply Voltage on VDDQ Relative to GND

–0.5V to +VDD

DC Voltage Applied to Outputs

 

 

in Tri-State

–0.5V to VDDQ + 0.5V

DC Input Voltage

–0.5V to VDD + 0.5V

Current into Outputs (LOW)

20 mA

Static Discharge Voltage

> 2001V

(per MIL-STD-883, Method 3015)

 

 

Latch-up Current

> 200 mA

Operating Range

 

 

 

 

 

 

 

 

Ambient

 

 

 

Range

Temperature

 

VDD

VDDQ

Commercial

0°C to +70°C

 

3.3V –

2.5V – 5% to

 

 

 

5%/+10%

VDD

Industrial

–40°C to +85°C

 

Electrical Characteristics Over the Operating Range[14, 15]

Parameter

Description

Test Conditions

Min.

Max.

Unit

VDD

Power Supply Voltage

 

 

 

3.135

3.6

V

VDDQ

I/O Supply Voltage

for 3.3V I/O

 

3.135

VDD

V

 

 

for 2.5V I/O

 

2.375

2.625

V

 

 

 

 

 

 

 

VOH

Output HIGH Voltage

for 3.3V I/O, IOH = –4.0 mA

 

2.4

 

V

 

 

for 2.5V I/O, IOH = –1.0 mA

 

2.0

 

V

VOL

Output LOW Voltage

for 3.3V I/O, IOL = 8.0 mA

 

 

0.4

V

 

 

for 2.5V I/O, IOL = 1.0 mA

 

 

0.4

V

VIH

Input HIGH Voltage[14]

for 3.3V I/O

 

2.0

VDD + 0.3V

V

 

 

for 2.5V I/O

 

1.7

VDD + 0.3V

V

VIL

Input LOW Voltage[14]

for 3.3V I/O

 

–0.3

0.8

V

 

 

for 2.5V I/O

 

–0.3

0.7

V

 

 

 

 

 

 

 

IX

Input Leakage Current

GND VI VDDQ

 

–5

5

A

 

except ZZ and MODE

 

 

 

 

 

 

 

Input Current of MODE

Input = VSS

 

–30

 

A

 

 

Input = VDD

 

 

5

A

 

Input Current of ZZ

Input = VSS

 

–5

 

A

 

 

Input = VDD

 

 

30

A

IOZ

Output Leakage Current

GND VI VDDQ, Output Disabled

 

–5

5

A

IDD

VDD Operating Supply

VDD = Max., IOUT = 0 mA,

 

4-ns cycle, 250 MHz

 

250

mA

 

Current

f = fMAX = 1/tCYC

 

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

220

mA

 

 

 

 

6-ns cycle, 166 MHz

 

180

mA

 

 

 

 

 

 

 

 

ISB1

Automatic CE

VDD = Max, Device Deselected,

 

4-ns cycle, 250 MHz

 

130

mA

 

Power-down

VIN VIH or VIN VIL

 

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

120

mA

 

Current—TTL Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

 

 

6-ns cycle, 166 MHz

 

110

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

ISB2

Automatic CE

VDD = Max, Device Deselected,

 

All speeds

 

40

mA

 

Power-down

VIN 0.3V or VIN > VDDQ – 0.3V,

 

 

 

 

 

 

Current—CMOS Inputs

f = 0

 

 

 

 

 

ISB3

Automatic CE

VDD = Max, Device Deselected, or

 

4-ns cycle, 250 MHz

 

120

mA

 

Power-down

VIN 0.3V or VIN > VDDQ – 0.3V

 

 

 

 

 

 

 

5-ns cycle, 200 MHz

 

110

mA

 

Current—CMOS Inputs

f = fMAX = 1/tCYC

 

 

 

 

 

 

 

6-ns cycle, 166 MHz

 

100

mA

 

 

 

 

 

 

 

 

 

 

 

 

 

ISB4

Automatic CE

VDD = Max, Device Deselected,

 

All Speeds

 

40

mA

 

Power-down

VIN VIH or VIN VIL, f = 0

 

 

 

 

 

 

Current—TTL Inputs

 

 

 

 

 

 

Notes:

 

 

 

 

 

 

 

14.Overshoot: VIH(AC) < VDD +1.5V (Pulse width less than tCYC/2), undershoot: VIL(AC) > –2V (Pulse width less than tCYC/2).

15.TPower-up: Assumes a linear ramp from 0V to VDD(min.) within 200 ms. During this time VIH < VDD and VDDQ < VDD.

Document #: 38-05540 Rev. *H

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Contents Functional Description1 FeaturesLogic Block Diagram CY7C1362C 512K x Cypress Semiconductor Corporation250 MHz 200 MHz 166 MHz Unit Maximum Access Time Maximum Operating CurrentSelection Guide Maximum Cmos Standby Current Document # 38-05540 Rev. *HPin Configurations Pin Tqfp Pinout 3 Chip Enables a Version CY7C1360C 256K XCY7C1362C 512K x Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ Version CY7C1362CNC/72M NC/36M Pin Configurations Ball BGA Pinout 2 Chip Enables with JtagNC/576M NC/288MPin Configurations Ball Fbga Pinout 3 Chip Enable with Jtag NC/18MNC/72M Pin Definitions Single Write Accesses Initiated by Adsc Single Read AccessesSingle Write Accesses Initiated by Adsp Functional OverviewInterleaved Burst Address Table Mode = Floating or VDD Linear Burst Address Table Mode = GNDZZ Mode Electrical Characteristics Write Cycle, Continue Burst Next Read Cycle, Suspend Burst Partial Truth Table for Read/Write5Read Cycle, Continue Burst Next Write Cycle, Suspend BurstTruth Table for Read/Write5 Disabling the Jtag FeatureTest Access Port TAP Ieee 1149.1 Serial Boundary Scan JtagTAP Registers TAP Controller Block DiagramPerforming a TAP Reset TAP Instruction SetTAP Timing Idcode3V TAP AC Test Conditions TAP AC Switching Characteristics Over the Operating Range10TAP DC Electrical Characteristics And Operating Conditions 5V TAP AC Test ConditionsIdentification Register Definitions Scan Register SizesIdentification Codes Ball Fbga Boundary Scan Order CY7C1360C 256K x Bit# Ball ID SignalCY7C1362C 512K x Bit# Ball ID Signal NameCY7C1362C 512K x Bit# Ball ID Signal Name Ball BGA Boundary Scan OrderOperating Range Electrical Characteristics Over the Operating Range14Maximum Ratings Ambient RangeAC Test Loads and Waveforms Capacitance16Thermal Resistance 3V I/O Test LoadMin Max Switching Characteristics Over the Operating Range 17250 200 166 Parameter Description Unit Min Set-up TimesSwitching Waveforms Read Cycle Timing23Write Cycle Timing23 BWE BWX ADVRead/Write Cycle Timing23, 25 CLZZZ Mode Timing27 DON’T CareOrdering Information CY7C1360C CY7C1362C CY7C1360C CY7C1362C Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Pbga 14 x 22 x 2.4 mm 90±0.05Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History