Cypress CY7C1362C Switching Characteristics Over the Operating Range 17, Min Max, Set-up Times

Page 20

CY7C1360C

CY7C1362C

Switching Characteristics Over the Operating Range [17, 18]

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

–250

 

 

–200

–166

 

Parameter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Description

 

 

 

 

 

 

 

Unit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Min.

 

Max.

Min.

 

Max.

Min.

Max.

 

 

 

 

 

 

 

 

 

 

 

 

t

 

V (Typical) to the First Access[19]

1

 

 

1

 

 

1

 

ms

POWER

 

DD

 

 

 

 

 

 

 

 

 

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

4.0

 

 

5.0

 

 

6.0

 

ns

tCH

 

Clock HIGH

1.8

 

 

2.0

 

 

2.4

 

ns

tCL

 

Clock LOW

1.8

 

 

2.0

 

 

2.4

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCO

 

Data Output Valid after CLK Rise

 

 

2.8

 

 

3.0

 

3.5

ns

tDOH

 

Data Output Hold after CLK Rise

1.25

 

 

1.25

 

 

1.25

 

ns

tCLZ

 

Clock to Low-Z[20, 21, 22]

1.25

 

 

1.25

 

 

1.25

 

ns

tCHZ

 

Clock to High-Z[20, 21, 22]

1.25

 

2.8

1.25

 

3.0

1.25

3.5

ns

tOEV

 

 

 

LOW to Output Valid

 

 

2.8

 

 

3.0

 

3.5

ns

OE

 

 

 

 

tOELZ

 

 

 

LOW to Output Low-Z[20, 21, 22]

0

 

 

0

 

 

0

 

ns

OE

 

 

 

 

tOEHZ

 

 

 

HIGH to Output High-Z[20, 21, 22]

 

 

2.8

 

 

3.0

 

3.5

ns

OE

 

 

 

 

Set-up Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Set-up before CLK Rise

1.4

 

 

1.5

 

 

1.5

 

ns

tADS

 

 

 

 

 

 

 

 

 

 

 

 

 

Set-up before CLK Rise

1.4

 

 

1.5

 

 

1.5

 

ns

ADSC,

ADSP

 

 

 

 

tADVS

 

 

 

 

 

Set-up before CLK Rise

1.4

 

 

1.5

 

 

1.5

 

ns

ADV

 

 

 

 

tWES

 

 

 

 

 

 

 

 

 

 

 

 

 

X Set-up before CLK Rise

1.4

 

 

1.5

 

 

1.5

 

ns

GW,

BWE,

BW

 

 

 

 

tDS

 

Data Input Set-up before CLK Rise

1.4

 

 

1.5

 

 

1.5

 

ns

tCES

 

Chip Enable Set-up before CLK Rise

1.4

 

 

1.5

 

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold after CLK Rise

0.4

 

 

0.5

 

 

0.5

 

ns

tADH

 

 

 

 

 

 

 

 

 

 

 

Hold after CLK Rise

0.4

 

 

0.5

 

 

0.5

 

ns

ADSP,

ADSC

 

 

 

 

tADVH

 

 

 

 

Hold after CLK Rise

0.4

 

 

0.5

 

 

0.5

 

ns

ADV

 

 

 

 

tWEH

 

 

 

 

 

 

 

 

 

 

 

 

 

X Hold after CLK Rise

0.4

 

 

0.5

 

 

0.5

 

ns

GW,

BWE,

BW

 

 

 

 

tDH

 

Data Input Hold after CLK Rise

0.4

 

 

0.5

 

 

0.5

 

ns

tCEH

 

Chip Enable Hold after CLK Rise

0.4

 

 

0.5

 

 

0.5

 

ns

Notes:

17.Timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V.

18.Test conditions shown in (a) of AC Test Loads unless otherwise noted.

19.This part has a voltage regulator internally; tPOWER is the time that the power needs to be supplied above VDD(minimum) initially before a Read or Write operation can be initiated.

20.tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage.

21.At any given voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z prior to Low-Z under the same system conditions.

22.This parameter is sampled and not 100% tested.

Document #: 38-05540 Rev. *H

Page 20 of 31

[+] Feedback

Image 20
Contents Features Logic Block Diagram CY7C1362C 512K xFunctional Description1 Cypress Semiconductor CorporationMaximum Access Time Maximum Operating Current Selection Guide250 MHz 200 MHz 166 MHz Unit Maximum Cmos Standby Current Document # 38-05540 Rev. *HCY7C1362C 512K x Pin Configurations Pin Tqfp Pinout 3 Chip Enables a VersionCY7C1360C 256K X Pin Configurations Pin Tqfp Pinout 2 Chip Enables AJ Version CY7C1362CPin Configurations Ball BGA Pinout 2 Chip Enables with Jtag NC/576MNC/72M NC/36M NC/288MNC/72M Pin Configurations Ball Fbga Pinout 3 Chip Enable with JtagNC/18M Pin Definitions Single Read Accesses Single Write Accesses Initiated by AdspSingle Write Accesses Initiated by Adsc Functional OverviewZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Partial Truth Table for Read/Write5 Read Cycle, Continue Burst NextWrite Cycle, Continue Burst Next Read Cycle, Suspend Burst Write Cycle, Suspend BurstDisabling the Jtag Feature Test Access Port TAPTruth Table for Read/Write5 Ieee 1149.1 Serial Boundary Scan JtagTAP Controller Block Diagram Performing a TAP ResetTAP Registers TAP Instruction SetTAP Timing IdcodeTAP AC Switching Characteristics Over the Operating Range10 TAP DC Electrical Characteristics And Operating Conditions3V TAP AC Test Conditions 5V TAP AC Test ConditionsIdentification Codes Identification Register DefinitionsScan Register Sizes CY7C1360C 256K x Bit# Ball ID Signal CY7C1362C 512K x Bit# Ball ID SignalBall Fbga Boundary Scan Order NameCY7C1362C 512K x Bit# Ball ID Signal Name Ball BGA Boundary Scan OrderElectrical Characteristics Over the Operating Range14 Maximum RatingsOperating Range Ambient RangeCapacitance16 Thermal ResistanceAC Test Loads and Waveforms 3V I/O Test LoadSwitching Characteristics Over the Operating Range 17 250 200 166 Parameter Description Unit MinMin Max Set-up TimesSwitching Waveforms Read Cycle Timing23Write Cycle Timing23 BWE BWX ADVRead/Write Cycle Timing23, 25 CLZZZ Mode Timing27 DON’T CareOrdering Information CY7C1360C CY7C1362C CY7C1360C CY7C1362C Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Pbga 14 x 22 x 2.4 mm 90±0.05Soldernotespad Type NON-SOLDER Mask Defined Nsmd Issue Date Orig. Description of Change Document History