Cypress CY7C1473BV33, CY7C1475BV33, CY7C1471BV33 Capacitance, Thermal Resistance, 5V IO Test Load

CY7C1471BV33

CY7C1473BV33, CY7C1475BV33

Capacitance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 BGA	Unit
			Package	Package	Package
CADDRESS	Address Input Capacitance	TA = 25°C, f = 1 MHz,	6	6	6	pF
		VDD = 3.3V
CDATA	Data Input Capacitance		5	5	5	pF
		VDDQ = 2.5V
CCTRL	Control Input Capacitance		8	8	8	pF
CCLK	Clock Input Capacitance		6	6	6	pF
CI/O	Input/Output Capacitance		5	5	5	pF

Thermal Resistance

Tested initially and after any design or process change that may affect these parameters.

Parameter	Description	Test Conditions	100 TQFP	165 FBGA	209 FBGA	Unit
			Max	Max	Max
ΘJA	Thermal Resistance	Test conditions follow standard	24.63	16.3	15.2	°C/W
	(Junction to Ambient)	test methods and procedures for
		measuring thermal impedance,
ΘJC	Thermal Resistance		2.28	2.1	1.7	°C/W
		according to EIA/JESD51.
	(Junction to Case)
		Figure 4. AC Test Loads and Waveforms

3.3V IO Test Load

OUTPUT

3.3V

R = 317Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 351Ω

GND

≤ 1 ns

VL = 1.5V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

2.5V IO Test Load

OUTPUT

2.5V

R = 1667Ω

ALL INPUT PULSES

VDDQ

Z0

= 50Ω

OUTPUT

RL

= 50Ω

10%

90%

5 pF

R = 1538Ω

GND

≤ 1 ns

VL = 1.25V

INCLUDING

(c)

(a)

JIG AND

(b)

SCOPE

90%

10%

≤ 1 ns

90%

10%

≤ 1 ns

Document #: 001-15029 Rev. *B Page 23 of 32

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