Cypress CY7C1471BV33, CY7C1475BV33 manual Selection Guide Functional Description, Features

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CY7C1471BV33

CY7C1473BV33, CY7C1475BV33

72-Mbit (2M x 36/4M x 18/1M x 72) Flow-Through SRAM with NoBL™ Architecture

Features

No Bus Latency™ (NoBL™) architecture eliminates dead cycles between write and read cycles

Supports up to 133 MHz bus operations with zero wait states

Data is transferred on every clock

Pin compatible and functionally equivalent to ZBT™ devices

Internally self timed output buffer control to eliminate the need to use OE

Registered inputs for flow through operation

Byte Write capability

3.3V/2.5V IO supply (VDDQ)

Fast clock-to-output times

6.5 ns (for 133 MHz device)

Clock Enable (CEN) pin to enable clock and suspend operation

Synchronous self-timed writes

Asynchronous Output Enable (OE)

CY7C1471BV33, CY7C1473BV33 available in JEDEC-standard Pb-free 100-pin TQFP, Pb-free and non-Pb-free 165-Ball FBGA package. CY7C1475BV33 available in Pb-free and non-Pb-free 209-Ball FBGA package

Three Chip Enables (CE1, CE2, CE3) for simple depth expansion

Automatic power down feature available using ZZ mode or CE deselect

IEEE 1149.1 JTAG Boundary Scan compatible

Burst Capability—linear or interleaved burst order

Low standby power

Selection Guide

Functional Description

The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 are 3.3V, 2M x 36/4M x 18/1M x 72 synchronous flow through burst SRAMs designed specifically to support unlimited true back-to-back read or write operations without the insertion of wait states. The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 are equipped with the advanced No Bus Latency (NoBL) logic. NoBL™ is required to enable consecutive read or write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent write-read transitions.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Maximum access delay from the clock rise is 6.5 ns (133 MHz device).

Write operations are controlled by two or four Byte Write Select (BWX) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output tri-state control. To avoid bus contention, the output drivers are synchronously tri-stated during the data portion of a write sequence. For best practice recommendations, refer to the Cypress application note AN1064 “SRAM System Guidelines”.

Description

133 MHz

117 MHz

Unit

Maximum Access Time

6.5

8.5

ns

 

 

 

 

Maximum Operating Current

305

275

mA

 

 

 

 

Maximum CMOS Standby Current

120

120

mA

 

 

 

 

Cypress Semiconductor Corporation • 198 Champion Court

San Jose, CA 95134-1709

408-943-2600

Document #: 001-15029 Rev. *B

 

Revised March 05, 2008

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Contents Selection Guide Functional Description FeaturesDescription 133 MHz 117 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1473BV33 4M x Logic Block Diagram CY7C1471BV33 2M xLogic Block Diagram CY7C1475BV33 1M x CY7C1471BV33 Pin ConfigurationCY7C1473BV33 CY7C1473BV33 4M x Ball Fbga 15 x 17 x 1.4 mm Pinout CY7C1471BV33 2M xNC/1G Ball Fbga 14 x 22 x 1.76 mm Pinout CY7C1475BV33 1M ×Pin Definitions Burst Read Accesses Single Read AccessesFunctional Overview Interleaved Burst Address Table ZZ Mode Electrical CharacteristicsLinear Burst Address Table Address Operation Truth TableUsed Read/write truth table for CY7C1471BV33 follows.1, 2 Truth Table for Read/WriteFunction Test Access Port TAP Disabling the Jtag FeaturePerforming a TAP Reset Ieee 1149.1 Serial Boundary Scan JtagOverview TAP Instruction SetTEST-LOGIC Reset RUN-TEST Idle TAP Controller State DiagramCircuitry TAP Controller Block Diagram3V TAP AC Test Conditions TAP DC Electrical Characteristics and Operating Conditions5V TAP AC Test Conditions GND VIN VddqTAP Timing TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeBoundary Scan Exit Order 4M x Boundary Scan Exit Order 2M xBit # Ball ID Boundary Scan Exit Order 1M x Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceParameter Description Test Conditions Tqfp Fbga Unit Max 5V IO Test LoadParameter Description 133 MHz 117 MHz Unit Min Switching CharacteristicsMin Max Read RiteBW AD Switching WaveformsAddress StallZZ Mode Timing Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History Issue Orig. of Change Description of Change DateVKN/KKVTMP VKN/AESA