Cypress CY7C1473BV33, CY7C1475BV33, CY7C1471BV33 manual Pin Definitions

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CY7C1471BV33

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CY7C1473BV33, CY7C1475BV33

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pin Definitions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Name

IO

Description

 

A0, A1, A

Input-

Address Inputs used to select one of the Address Locations. Sampled at the rising edge

 

 

 

 

 

 

 

 

 

 

 

Synchronous

of the CLK. A[1:0] is fed to the two-bit burst counter.

 

 

 

 

A,

 

 

B,

Input-

Byte Write Inputs, Active LOW. Qualified with

 

to conduct writes to the SRAM. Sampled

 

BW

BW

WE

 

BWC, BWD,

Synchronous

on the rising edge of CLK.

 

BWE, BWF,

 

 

 

 

 

 

 

 

 

 

 

BWG, BWH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Write Enable Input, Active LOW. Sampled on the rising edge of CLK if

 

is active LOW.

 

WE

CEN

 

 

 

 

 

 

 

 

 

 

 

Synchronous

This signal must be asserted LOW to initiate a write sequence.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Advance/Load Input. Advances the on-chip address counter or loads a new address. When

 

ADV/LD

 

 

 

 

 

 

 

 

 

 

 

Synchronous

HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new

 

 

 

 

 

 

 

 

 

 

 

 

 

 

address can be loaded into the device for an access. After deselection, drive ADV/LD LOW to

 

 

 

 

 

 

 

 

 

 

 

 

 

 

load a new address.

 

 

 

 

 

 

 

CLK

Input-

Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with

 

 

 

CEN.

 

 

 

 

 

 

 

 

 

 

 

Clock

CLK is only recognized if CEN is active LOW.

 

 

 

 

 

 

 

 

1

 

Input-

Chip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction

 

CE

 

 

 

 

 

 

 

 

 

 

 

Synchronous

with CE2 and CE3 to select or deselect the device.

 

CE2

Input-

Chip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction

 

 

 

 

 

 

 

 

 

 

 

Synchronous

with CE1 and CE3 to select or deselect the device.

 

 

3

 

Input-

Chip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction

 

CE

 

 

 

 

 

 

 

 

 

 

 

Synchronous

with CE1 and CE2 to select or deselect the device.

 

 

 

 

 

Input-

Output Enable, Asynchronous Input, Active LOW. Combined with the synchronous logic

 

OE

 

 

 

 

 

 

 

 

 

 

 

Asynchronous

block inside the device to control the direction of the IO pins. When LOW, the IO pins are enabled

 

 

 

 

 

 

 

 

 

 

 

 

 

 

to behave as outputs. When deasserted HIGH, IO pins are tri-stated, and act as input data pins.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OE is masked during the data portion of a write sequence, during the first clock when emerging

 

 

 

 

 

 

 

 

 

 

 

 

 

 

from a deselected state, and when the device is deselected.

 

 

 

 

 

 

 

 

 

 

 

 

Input-

Clock Enable Input, Active LOW. When asserted LOW the clock signal is recognized by the

 

CEN

 

 

 

 

 

 

 

 

 

 

 

Synchronous

SRAM. When deasserted HIGH the clock signal is masked. Because deasserting CEN does

 

 

 

 

 

 

 

 

 

 

 

 

 

 

not deselect the device, CEN can be used to extend the previous cycle when required.

 

 

 

 

 

ZZ

Input-

ZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep”

 

 

 

 

 

 

 

 

 

 

 

Asynchronous

condition with data integrity preserved. During normal operation, this pin must be LOW or left

 

 

 

 

 

 

 

 

 

 

 

 

 

 

floating. ZZ pin has an internal pull down.

 

 

 

 

 

DQs

IO-

Bidirectional Data IO Lines. As inputs, they feed into an on-chip data register that is triggered

 

 

 

 

 

 

 

 

 

 

 

Synchronous

by the rising edge of CLK. As outputs, they deliver the data contained in the memory location

 

 

 

 

 

 

 

 

 

 

 

 

 

 

specified by the addresses presented during the previous clock rise of the read cycle. The

 

 

 

 

 

 

 

 

 

 

 

 

 

 

direction of the pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

When HIGH, DQs and DQPX are placed in a tri-state condition.The outputs are automatically

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tri-stated during the data portion of a write sequence, during the first clock when emerging from

 

 

 

 

 

 

 

 

 

 

 

 

 

 

a deselected state, and when the device is deselected, regardless of the state of OE.

 

 

 

 

 

DQPX

IO-

Bidirectional Data Parity IO Lines. Functionally, these signals are identical to DQs. During

 

 

 

 

 

 

 

 

 

 

 

Synchronous

write sequences, DQPX is controlled by BWX correspondingly.

 

MODE

Input Strap Pin

Mode Input. Selects the Burst Order of the Device. When tied to Gnd selects linear burst

 

 

 

 

 

 

 

 

 

 

 

 

 

 

sequence. When tied to VDD or left floating selects interleaved burst sequence.

 

VDD

Power Supply

Power Supply Inputs to the Core of the Device.

 

VDDQ

IO Power Supply

Power Supply for the IO Circuitry.

 

VSS

Ground

Ground for the Device.

Document #: 001-15029 Rev. *B

 

 

 

 

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Contents Features Selection Guide Functional DescriptionDescription 133 MHz 117 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1471BV33 2M x Logic Block Diagram CY7C1473BV33 4M xLogic Block Diagram CY7C1475BV33 1M x Pin Configuration CY7C1471BV33CY7C1473BV33 Ball Fbga 15 x 17 x 1.4 mm Pinout CY7C1471BV33 2M x CY7C1473BV33 4M xBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1475BV33 1M × NC/1GPin Definitions Functional Overview Single Read AccessesBurst Read Accesses Linear Burst Address Table ZZ Mode Electrical CharacteristicsInterleaved Burst Address Table Used Truth TableAddress Operation Function Truth Table for Read/WriteRead/write truth table for CY7C1471BV33 follows.1, 2 Disabling the Jtag Feature Test Access Port TAPPerforming a TAP Reset Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set OverviewTAP Controller State Diagram TEST-LOGIC Reset RUN-TEST IdleTAP Controller Block Diagram CircuitryTAP DC Electrical Characteristics and Operating Conditions 3V TAP AC Test Conditions5V TAP AC Test Conditions GND VIN VddqTAP AC Switching Characteristics TAP TimingIdentification Register Definitions Scan Register SizesIdentification Codes Register Name Bit SizeBit # Ball ID Boundary Scan Exit Order 2M xBoundary Scan Exit Order 4M x Boundary Scan Exit Order 1M x Electrical Characteristics Maximum RatingsOperating Range Range AmbientCapacitance Thermal ResistanceParameter Description Test Conditions Tqfp Fbga Unit Max 5V IO Test LoadMin Max Switching CharacteristicsParameter Description 133 MHz 117 MHz Unit Min Rite ReadSwitching Waveforms BW ADAddress StallZZ Mode Timing Ordering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Orig. of Change Description of Change Date Document HistoryVKN/KKVTMP VKN/AESA