Cypress CY7C1475BV33 Switching Characteristics, Parameter Description 133 MHz 117 MHz Unit Min

Page 24

CY7C1471BV33

CY7C1473BV33, CY7C1475BV33

Switching Characteristics

Over the Operating Range. Unless otherwise noted in the following table, timing reference level is 1.5V when VDDQ = 3.3V and is 1.25V when VDDQ = 2.5V. Test conditions shown in (a) of AC Test Loads and Waveforms on page 23 unless otherwise noted.

Parameter

 

 

 

 

 

 

 

 

Description

133 MHz

117 MHz

Unit

 

 

 

 

 

 

 

 

Min

Max

Min

Max

 

 

 

 

 

 

 

 

 

 

 

tPOWER [16]

 

 

 

 

 

 

 

 

 

1

 

1

 

ms

Clock

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tCYC

 

Clock Cycle Time

7.5

 

10

 

ns

tCH

 

Clock HIGH

2.5

 

3.0

 

ns

tCL

 

Clock LOW

2.5

 

3.0

 

ns

Output Times

 

 

 

 

 

 

 

 

 

 

 

 

tCDV

 

Data Output Valid After CLK Rise

 

6.5

 

8.5

ns

tDOH

 

Data Output Hold After CLK Rise

2.5

 

2.5

 

ns

t

 

Clock to Low-Z [17, 18, 19]

3.0

 

3.0

 

ns

CLZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

 

Clock to High-Z [17, 18, 19]

 

3.8

 

4.5

ns

CHZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tOEV

 

 

 

LOW to Output Valid

 

3.0

 

3.8

ns

OE

 

 

t

 

 

 

LOW to Output Low-Z [17, 18, 19]

0

 

0

 

ns

OE

 

 

OELZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t

 

 

 

HIGH to Output High-Z [17, 18, 19]

 

3.0

 

4.0

ns

OE

 

 

OEHZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Setup Times

 

 

 

 

 

 

 

 

 

 

 

 

tAS

 

Address Setup Before CLK Rise

1.5

 

1.5

 

ns

tALS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

 

Setup Before CLK Rise

1.5

 

1.5

 

ns

tWES

 

 

 

 

 

 

 

 

X Setup Before CLK Rise

1.5

 

1.5

 

ns

WE,

BW

 

 

tCENS

 

 

 

 

Setup Before CLK Rise

1.5

 

1.5

 

ns

CEN

 

 

tDS

 

Data Input Setup Before CLK Rise

1.5

 

1.5

 

ns

tCES

 

Chip Enable Setup Before CLK Rise

1.5

 

1.5

 

ns

Hold Times

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tAH

 

Address Hold After CLK Rise

0.5

 

0.5

 

ns

tALH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADV/LD

Hold After CLK Rise

0.5

 

0.5

 

ns

tWEH

 

 

 

 

 

 

 

X Hold After CLK Rise

0.5

 

0.5

 

ns

WE,

BW

 

 

tCENH

 

 

 

 

Hold After CLK Rise

0.5

 

0.5

 

ns

CEN

 

 

tDH

 

Data Input Hold After CLK Rise

0.5

 

0.5

 

ns

tCEH

 

Chip Enable Hold After CLK Rise

0.5

 

0.5

 

ns

Notes

16.This part has an internal voltage regulator; tPOWER is the time that the power must be supplied above VDD(minimum) initially, before a read or write operation is initiated.

17.tCHZ, tCLZ,tOELZ, and tOEHZ are specified with AC test conditions shown in part (b) of AC Test Loads and Waveforms on page 23. Transition is measured ±200 mV from steady-state voltage.

18.At any supplied voltage and temperature, tOEHZ is less than tOELZ and tCHZ is less than tCLZ to eliminate bus contention between SRAMs when sharing the same data bus. These specifications do not imply a bus contention condition, but reflect parameters guaranteed over worst case user conditions. Device is designed to achieve High-Z before Low-Z under the same system conditions.

19.This parameter is sampled and not 100% tested.

Document #: 001-15029 Rev. *B

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Contents Features Selection Guide Functional DescriptionDescription 133 MHz 117 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1471BV33 2M x Logic Block Diagram CY7C1473BV33 4M xLogic Block Diagram CY7C1475BV33 1M x Pin Configuration CY7C1471BV33CY7C1473BV33 Ball Fbga 15 x 17 x 1.4 mm Pinout CY7C1471BV33 2M x CY7C1473BV33 4M xBall Fbga 14 x 22 x 1.76 mm Pinout CY7C1475BV33 1M × NC/1GPin Definitions Single Read Accesses Burst Read AccessesFunctional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address TableLinear Burst Address Table Truth Table Address OperationUsed Truth Table for Read/Write Read/write truth table for CY7C1471BV33 follows.1, 2Function Disabling the Jtag Feature Test Access Port TAPPerforming a TAP Reset Ieee 1149.1 Serial Boundary Scan JtagTAP Instruction Set OverviewTAP Controller State Diagram TEST-LOGIC Reset RUN-TEST IdleTAP Controller Block Diagram CircuitryTAP DC Electrical Characteristics and Operating Conditions 3V TAP AC Test Conditions5V TAP AC Test Conditions GND VIN VddqTAP AC Switching Characteristics TAP TimingIdentification Register Definitions Scan Register SizesIdentification Codes Register Name Bit SizeBoundary Scan Exit Order 2M x Boundary Scan Exit Order 4M xBit # Ball ID Boundary Scan Exit Order 1M x Electrical Characteristics Maximum RatingsOperating Range Range AmbientCapacitance Thermal ResistanceParameter Description Test Conditions Tqfp Fbga Unit Max 5V IO Test LoadSwitching Characteristics Parameter Description 133 MHz 117 MHz Unit MinMin Max Rite ReadSwitching Waveforms BW ADAddress StallZZ Mode Timing Ordering Information Package Diagrams Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mmBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Issue Orig. of Change Description of Change Date Document HistoryVKN/KKVTMP VKN/AESA