Cypress CY7C1475BV33, CY7C1471BV33 Functional Overview, Single Read Accesses, Burst Read Accesses

Page 9

 

 

 

 

CY7C1471BV33

 

 

 

 

CY7C1473BV33, CY7C1475BV33

 

 

 

 

 

 

 

 

 

Pin Definitions (continued)

 

 

 

 

Name

IO

Description

TDO

JTAG serial

Serial Data-Out to the JTAG Circuit. Delivers data on the negative edge of TCK. If the JTAG

 

output

feature is not used, this pin must be left unconnected. This pin is not available on TQFP

 

Synchronous

packages.

 

 

 

TDI

JTAG serial input

Serial Data-In to the JTAG Circuit. Sampled on the rising edge of TCK. If the JTAG feature is

 

Synchronous

not used, this pin can be left floating or connected to VDD through a pull up resistor. This pin is

 

 

 

 

not available on TQFP packages.

 

 

 

TMS

JTAG serial input

Serial Data-In to the JTAG Circuit. Sampled on the rising edge of TCK. If the JTAG feature is

 

Synchronous

not used, this pin can be disconnected or connected to VDD. This pin is not available on TQFP

 

 

 

 

packages.

 

 

 

TCK

JTAG

Clock Input to the JTAG Circuitry. If the JTAG feature is not used, this pin must be connected

 

-Clock

to VSS. This pin is not available on TQFP packages.

NC

-

 

 

No Connects. Not internally connected to the die. 144M, 288M, 576M, and 1G are address

 

 

 

 

expansion pins and are not internally connected to the die.

 

 

 

 

 

Functional Overview

The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 are synchronous flow through burst SRAMs designed specifically to eliminate wait states during write-read transitions. All synchronous inputs pass through input registers controlled by the rising edge of the clock. The clock signal is qualified with the Clock Enable input signal (CEN). If CEN is HIGH, the clock signal is not recognized and all internal states are maintained. All synchronous operations are qualified with CEN. Maximum access delay from the clock rise (tCDV) is 6.5 ns (133 MHz device).

Accesses may be initiated by asserting all three Chip Enables (CE1, CE2, CE3) active at the rising edge of the clock. If (CEN) is active LOW and ADV/LD is asserted LOW, the address presented to the device is latched. The access can either be a read or write operation, depending on the status of the Write Enable (WE). Byte Write Select (BWX) can be used to conduct Byte Write operations.

Write operations are qualified by the Write Enable (WE). All writes are simplified with on-chip synchronous self timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) simplify depth expansion. All operations (reads, writes, and deselects) are pipelined. ADV/LD must be driven LOW after the device is deselected to load a new address for the next operation.

Single Read Accesses

A read access is initiated when these conditions are satisfied at clock rise:

CEN is asserted LOW

CE1, CE2, and CE3 are ALL asserted active

WE is deasserted HIGH

ADV/LD is asserted LOW

The address presented to the address inputs is latched into the Address Register and presented to the memory array and control logic. The control logic determines that a read access is in progress and allows the requested data to propagate to the output buffers. The data is available within 6.5 ns (133 MHz device) provided OE is active LOW. After the first clock of the read access, the output buffers are controlled by OE and the internal control logic. OE must be driven LOW to drive out the requested data. On the subsequent clock, another operation (read/write/deselect) can be initiated. When the SRAM is deselected at clock rise by one of the chip enable signals, output is tri-stated immediately.

Burst Read Accesses

The CY7C1471BV33, CY7C1473BV33, and CY7C1475BV33 have an on-chip burst counter that enables the user to supply a single address and conduct up to four reads without reasserting the address inputs. ADV/LD must be driven LOW to load a new address into the SRAM, as described in the Single Read Access section. The sequence of the burst counter is determined by the MODE input signal. A LOW input on MODE selects a linear burst mode, a HIGH selects an interleaved burst sequence. Both burst counters use A0 and A1 in the burst sequence, and wrap around when incremented sufficiently. A HIGH input on ADV/LD increments the internal burst counter regardless of the state of chip enable inputs or WE. WE is latched at the beginning of a burst cycle. Therefore, the type of access (read or write) is maintained throughout the burst sequence.

Document #: 001-15029 Rev. *B

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Contents Selection Guide Functional Description FeaturesDescription 133 MHz 117 MHz Unit Cypress Semiconductor Corporation 198 Champion CourtLogic Block Diagram CY7C1473BV33 4M x Logic Block Diagram CY7C1471BV33 2M xLogic Block Diagram CY7C1475BV33 1M x CY7C1471BV33 Pin ConfigurationCY7C1473BV33 CY7C1473BV33 4M x Ball Fbga 15 x 17 x 1.4 mm Pinout CY7C1471BV33 2M xNC/1G Ball Fbga 14 x 22 x 1.76 mm Pinout CY7C1475BV33 1M ×Pin Definitions Single Read Accesses Burst Read AccessesFunctional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address TableLinear Burst Address Table Truth Table Address OperationUsed Truth Table for Read/Write Read/write truth table for CY7C1471BV33 follows.1, 2Function Test Access Port TAP Disabling the Jtag FeaturePerforming a TAP Reset Ieee 1149.1 Serial Boundary Scan JtagOverview TAP Instruction SetTEST-LOGIC Reset RUN-TEST Idle TAP Controller State DiagramCircuitry TAP Controller Block Diagram3V TAP AC Test Conditions TAP DC Electrical Characteristics and Operating Conditions5V TAP AC Test Conditions GND VIN VddqTAP Timing TAP AC Switching CharacteristicsScan Register Sizes Identification Register DefinitionsIdentification Codes Register Name Bit SizeBoundary Scan Exit Order 2M x Boundary Scan Exit Order 4M xBit # Ball ID Boundary Scan Exit Order 1M x Maximum Ratings Electrical CharacteristicsOperating Range Range AmbientThermal Resistance CapacitanceParameter Description Test Conditions Tqfp Fbga Unit Max 5V IO Test LoadSwitching Characteristics Parameter Description 133 MHz 117 MHz Unit MinMin Max Read RiteBW AD Switching WaveformsAddress StallZZ Mode Timing Ordering Information Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History Issue Orig. of Change Description of Change DateVKN/KKVTMP VKN/AESA