Cypress CY7C1474V33, CY7C1472V33, CY7C1470V33 manual Ieee 1149.1 Serial Boundary Scan Jtag

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CY7C1470V33

CY7C1472V33

CY7C1474V33

IEEE 1149.1 Serial Boundary Scan (JTAG)

The CY7C1470V33, CY7C1472V33, and CY7C1474V33 incorporates a serial boundary scan test access port (TAP). This port operates in accordance with IEEE Standard 1149.1-1990 but does not have the set of functions required for full 1149.1 compliance. These functions from the IEEE specification are excluded because their inclusion places an added delay in the critical speed path of the SRAM. Note that the TAP controller functions in a manner that does not conflict with the operation of other devices using 1149.1 fully compliant TAPs. The TAP operates using JEDEC-standard 3.3V or 2.5V I/O logic levels.

The CY7C1470V33, CY7C1472V33, and CY7C1474V33 contains a TAP controller, instruction register, boundary scan register, bypass register, and ID register.

Disabling the JTAG Feature

It is possible to operate the SRAM without using the JTAG feature. To disable the TAP controller, TCK must be tied LOW (VSS) to prevent clocking of the device. TDI and TMS are inter- nally pulled up and may be unconnected. They may alternately be connected to VDD through a pull-up resistor. TDO should be left unconnected. Upon power-up, the device will come up in a reset state which will not interfere with the operation of the device.

Test MODE SELECT (TMS)

The TMS input is used to give commands to the TAP controller and is sampled on the rising edge of TCK. It is allowable to leave this ball unconnected if the TAP is not used. The ball is pulled up internally, resulting in a logic HIGH level.

Test Data-In (TDI)

The TDI ball is used to serially input information into the registers and can be connected to the input of any of the registers. The register between TDI and TDO is chosen by the instruction that is loaded into the TAP instruction register. For information on loading the instruction register, see the TAP Controller State Diagram. TDI is internally pulled up and can be unconnected if the TAP is unused in an application. TDI is connected to the most significant bit (MSB) of any register. (See Tap Controller Block Diagram.)

Test Data-Out (TDO)

The TDO output ball is used to serially clock data-out from the registers. The output is active depending upon the current state of the TAP state machine. The output changes on the falling edge of TCK. TDO is connected to the least significant bit (LSB) of any register. (See Tap Controller State Diagram.)

TAP Controller Block Diagram

TAP Controller State Diagram

1

TEST-LOGIC

 

 

 

 

 

RESET

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

0

RUN-TEST/

1

SELECT

1

SELECT

1

IDLE

 

DR-SCAN

 

IR-SCAN

 

 

 

 

 

 

 

 

0

 

0

 

 

 

 

1

 

1

 

 

 

 

CAPTURE-DR

 

CAPTURE-IR

 

 

 

 

0

 

0

 

 

 

 

SHIFT-DR

0

SHIFT-IR

0

 

 

 

1

 

1

 

 

 

 

 

1

 

1

TDI

Selection Circuitry

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bypass Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Instruction Register

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

31

30

29

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Identification Register

 

 

 

 

 

 

 

 

 

 

x

.

.

.

.

.

2

1

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Boundary Scan Register

Selection Circuitry

TDO

EXIT1-DR

 

EXIT1-IR

 

 

0

 

 

0

 

PAUSE-DR

0

PAUSE-IR

0

 

1

 

 

1

 

0

 

 

0

 

 

EXIT2-DR

 

EXIT2-IR

 

 

1

 

 

1

 

UPDATE-DR

 

UPDATE-IR

 

1

0

 

1

0

 

The 0/1 next to each state represents the value of TMS at the rising edge of TCK.

Test Access Port (TAP)

Test Clock (TCK)

The test clock is used only with the TAP controller. All inputs are captured on the rising edge of TCK. All outputs are driven from the falling edge of TCK.

TCK

TMS

 

TAP CONTROLLER

 

Performing a TAP Reset

A RESET is performed by forcing TMS HIGH (VDD) for five rising edges of TCK. This RESET does not affect the operation of the SRAM and may be performed while the SRAM is operating.

At power-up, the TAP is reset internally to ensure that TDO comes up in a High-Z state.

TAP Registers

Registers are connected between the TDI and TDO balls and allow data to be scanned into and out of the SRAM test circuitry. Only one register can be selected at a time through the instruction register. Data is serially loaded into the TDI ball on the rising edge of TCK. Data is output on the TDO ball on the falling edge of TCK.

Document #: 38-05289 Rev. *I

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Contents Cypress Semiconductor Corporation FeaturesLogic Block Diagram-CY7C1470V33 2M x Functional DescriptionMaximum Cmos Standby Current Logic Block Diagram-CY7C1472V33 4M xMaximum Access Time Maximum Operating Current 250 MHz 200 MHz 167 MHz Unit4M x Pin Configurations Pin Tqfp PackagesCY7C1472V33 4M x BWS Byte Write Select Inputs, active LOW. Qualified with Pin DefinitionsPin Name Type Pin Description Functional Overview ZZ Mode Electrical Characteristics Interleaved Burst Address Table Mode = Floating or VDDLinear Burst Address Table Mode = GND Operation Address Used Function CY7C1474V33 Partial Write Cycle Description1, 2, 3Function CY7C1470V33 BW d BW c BW b BW a Function CY7C1472V33Ieee 1149.1 Serial Boundary Scan Jtag TAP Controller Block Diagram TAP Controller State DiagramTAP Instruction Set Instruction RegisterOutput Times TAP AC Switching Characteristics Over the Operating Range9TAP Timing Parameter Description Min Max Unit Clock5V TAP AC Test Conditions 3V TAP AC Test ConditionsIdentification Codes Identification Register DefinitionsScan Register Sizes Bit # Ball ID Boundary Scan Exit Order 2M xBoundary Scan Exit Order 4M x W10 Boundary Scan Exit Order 1M xA11 J10Ambient Range Electrical Characteristics Over the Operating Range13Maximum Ratings Operating RangeAC Test Loads and Waveforms Capacitance15Thermal Resistance Set-up Times Switching Characteristics Over the Operating Range 16250 200 167 Parameter Description Unit Min Max Address A1 A2 Switching WaveformsRead/Write/Timing22, 23 CENNOP, Stall and Deselect Cycles22, 23 ZZ Mode Timing26Ordering Information 250 Pin Thin Plastic Quad Flatpack 14 x 20 x 1.4 mm Package DiagramsBall Fbga 15 x 17 x 1.4 mm Ball Fbga 14 x 22 x 1.76 mm Document History ECN No Issue Date Orig. Description of ChangeVKN RXU